Abstract: An apparatus, and particularly, a wafer carrier for polishing the face of a semiconductor wafer are provided. The wafer carrier forms a first cavity which can be pressure controlled to vary the shape of a face of a platen which contacts the wafer during polishing. A second cavity within the first cavity is provided. The second cavity can be independently pressure controlled to form a vacuum for holding the wafer against the platen surface or for forming a pressure stream to separate the wafer from the platen and/or to purge the holes in the surface of the platen. A non-contact displacement sensor capable of measuring a distance between the wafer carrier mount and the platen, may be provided. An endpoint detector capable of detecting a relative surface roughness of the wafer, to determine when the wafer has been sufficiently polished, may also be provided. A ring is peripherally located about an outer edge of the platen, and is mounted and positioned to resist lateral forces on the wafer during polishing.

Abstract: Disclosed are methods of making dynamoelectric machines which include use of two sheet metal cup-shaped members to form a housing that completely surrounds and encloses the stator. The stator is assembled with a can in such a manner that the core of the stator is completely contained within the can. Thereafter, a cap is positioned at the exposed face of the stator and the cap and can are joined together by a sheet metal fastening technique which displaces material from one superposed sheet into a second sheet of material. The can and cap are precision formed so that they will have precision sized and located bearing receivers and core retention regions. Both the cap and the can are provided with multiple flange locations which are utilized for fastening the can and cap together during the assembly process.

Abstract: A low profile gimbal system is provided to greatly reduce the generation of moments about a pivot point of the gimbal system during polishing processes. The gimbal system is adjustable so that a preferred balance between stiffness and friction may be selected as appropriate for a variety of different polishing conditions. A locking feature ensures that the adjustment setting is maintained during polishing.

Abstract: An apparatus, and particularly, a wafer carrier for polishing the face of a semiconductor wafer are provided. The wafer carrier forms a first cavity which can be pressure controlled to vary the shape of a face of a platen which contacts the wafer during polishing. A second cavity within the first cavity is provided. The second cavity can be independently pressure controlled to form a vacuum for holding the wafer against the platen surface or for forming a pressure stream to separate the wafer from the platen and/or to purge the holes in the surface of the platen. A non-contact displacement sensor capable of measuring a distance between the wafer carrier mount and the platen, may be provided. An endpoint detector capable of detecting a relative surface roughness of the wafer, to determine when the wafer has been sufficiently polished, may also be provided. A ring is peripherally located about an outer edge of the platen, and is mounted and positioned to resist lateral forces on the wafer during polishing.

Abstract: A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring.

Abstract: An apparatus for polishing wafers, preferably by chemical mechanical polishing. The apparatus includes a table defining a planar polishing surface adapted to contain a polishing medium and a wafer carrier assembly adapted to hold a wafer against the polishing surface. The wafer carrier assembly includes a wafer carrier and prevents rotation of the wafer carrier with respect to the polishing table even when the wafer carrier is moved in a circular or orbital path on the polishing surface. Polishing is carried out relative movement between the wafer carrier and the polishing surface in any direction within the plane of the polishing surface. The relative movement can be accomplished by moving the wafer carrier, the polishing table, or a combination of movements of the wafer carrier and polishing table.

Abstract: A low profile, low hysteresis force feedback gimbal system is provided to greatly reduce the generation of moments about a pivot point of the gimbal system during polishing processes. A load cell is placed directly above a contact pin of the gimbal system to provide a very accurate feedback measurement of the amount of downward load applied to a substrate during polishing.

Abstract: A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring.

Abstract: Disclosed are methods of making dynamoelectric machines which include use of two sheet metal cup-shaped members to form a housing that completely surrounds and encloses the stator. The stator is assembled with a can in such a manner that the core of the stator is completely contained within the can. Thereafter, a cap is positioned at the exposed face of the stator and the cap and can are joined together by a sheet metal fastening technique which displaces material from one superposed sheet into a second sheet of material. The can and cap are precision formed so that they will have precision sized and located bearing receivers and core retention regions. Both the cap and the can are provided with multiple flange locations which are utilized for fastening the can and cap together during the assembly process.

Abstract: A method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring.

Abstract: An apparatus and method for identifying the presence of biological molecules labeled with isotopes that are identifiable and distinguishable by their responses to nuclear magnetic resonance. The method features the use of labels that are:1) not radioactive or only weakly radioactive, therefore not hazardous to handle, and have a long storage life.2) small in molecular weight, thus not significantly changing the electrophoresis migration rate of the labeled material.3) available as several distinguishable labels, thereby enabling simultaneous detection of several classes of molecules.

Abstract: A dental floss applicator having an elongated body, a bow across which the floss is to be stretched, a storage area for a supply of floss, a supply capstan for drawing the floss out of the storage area, a take-up capstan for disposal of the used floss, an axle to support the supply and take-up capstans, and guides to guide the floss between the bow and the capstans. The supply and take-up capstans are coaxial and integrated into one piece so that they rotate together as one rigid-body around the axle. The supply capstan is smaller in diameter than the take-up capstan, therefore, as the capstans are turned to advance the floss they also stretch the floss to generate floss tension. The axle is an extension of the body; it is hollow and it supports the capstans from a direction along the capstans common axis, on the side of the supply capstan (away from the take-up capstan). The guide is also an extension of the body, reaching axially over the supply capstan to guide the floss to the take-up capstan.

Abstract: A device for cleaning teeth comprising a stiff plastic filament one section of which is curly in shape. This curly section has a longitudinal axis along which tensional forces lie when tensional forces are applied to stretch the device. This curly section also extends laterally to provide contact lines which are oriented at an angle with respect to the longitudinal axis to scrape away unwanted materials on the surface of the teeth when the curly section is pulled longitudinally through the interdental areas. The device can be fabricated by winding a filament around metal pin, heating the filament, and then cooling the filament to provide the curly shape.

Abstract: A tethering strap for a baby's pacifier, bottle or the like includes an elongated strap having an elastic button at one end for detachable attachment to a pacifier and a clamp and a slit at the other end for detachable attachment to the clothing of an infant.

Abstract: An improved impact apparatus of the type in which an impact member delivers an impact to a work piece, an elongated guide confines the motion of the impact member to within a predetermined path, an input handle receives the input movement, and a speed multiplying mechanism transmits the input movement to the impact member. The input movement is received as an input force along an input axis causing the input handle to move at an input velocity. This input is transformed by the speed multiplying mechanism into an output force along an output axis, causing the impact member to move at an output velocity which is faster than the input velocity. For apparatus in which the speed multiplying mechanisms are not axially symmetric, thus having output axis laterally displaced from the input axis, the present invention provides improved positioning of the input and output axes along lines that pass near the center of gravity of the impact member, thus minimizing the unwanted torque on the moving parts.

Abstract: A splint to immobilize part of a limb having an elongated rigid sheet, a rigid collar and at least one retaining strap. The sheet is formed into a shape to conform to the surface of one side of the part of the limb to be immobilized. The collar, which is attached to one end of the sheet, extends circumferentially more than halfway around the limb, grips the limb, and holds it in a fixed position relative to the sheet. Retaining straps are used at other positions along the sheet to hold the limb against the splint. In one embodiment, the splint is made of stainless steel, the sheet is formed of intersecting strips of stainless steel that are spotwelded together at intersection points to form a perforated sheet having large holes distributed throughout its area for ventilation and removal of water from the surface of the limb.

Abstract: A splint for use with retaining straps to immobilize part of a limb comprising an elongated rigid sheet and a rigid collar. The sheet is formed into a shape to conform to the surface of one side of the part of the limb to be immobilized. The collar, which is attached to one end of the sheet, extends circumferentially more than halfway around the limb, grips the limb, and holds it in a fixed position relative to the sheet. Retaining straps are used at other positions along the sheet to hold the limb against the splint. In one embodiment, the splint is made of stainless steel, the sheet is formed of intersecting strips of stainless steel that are spotwelded together at intersection points to form a perforated sheet having large holes distributed throughout its area for ventilation and removal of water from the surface of the limb.

Abstract: A precision guided hammer or impact device includes a guide track on which is reciprocally mounted an impact member for movement between an impact position at one end of the guide member and a retracted position, and further includes a reciprocating manual input member which is connected by a multiplication linkage to the impact member for multiplying the input velocity for driving the impact member at a high velocity relative to the input velocity.

Abstract: A method for encapsulating magnetic particles by enclosure within oil drops, mixing in an aqueous solution and dispersing the oil drops with the enclosed particles by application of an alternating magnetic field. The dispersed and oil covered particles are microencapsulated with at least one type of polymer.