Abstract: A single-piece, high performance, inexpensively fabricated heat sink and electromagnetic interference (EMI) shield makes thermal contact with a heat generating device. Capillary forces exerted on the heat sink by cooling flowed solder draw the heat sink toward the PCB. The heat sink attaches directly to a printed circuit board (PCB), thus not stressing ball grid array (BGA) solder joints between the heat generating device and the PCB in applications with BGAs. The heat sink does not require any special tools for installation or removal nor any additional PCB space. The heat sink is designed to allow automated surface mounting techniques, such as pick and place. The single-piece construction eliminates the need for a separate clip, thereby increasing heat transfer area.

Abstract: A heat sink according to an embodiment of the present invention can be attached to any device without printed circuit board (PCB) modification. The heat sink may clamp on device edges, which does not stress solder balls between the device and heat sink. The heat sink may be configured to be installed to or removed from the device without special tools. The heat sink may be extruded, machined, or die cast aluminum or other material to reduce part and tooling cost, and may be black anodized to be electrically non-conductive. A single-piece embodiment eliminates a need for a separate clip, thereby increasing heat transfer by as much as twenty-five percent or more over heat sinks employing clips. Further, wavy fins or other heat dissipation configurations may increase heat transfer by at least eleven percent, for a total heat transfer improvement of at least thirty-six percent over a two-part heat sink.

Abstract: A mechanical set of plates is able to simultaneously and quickly removably secure and remove one or more printed circuit boards (PCBs) in an enclosure in one single motion, and act as a heat sink to conduct heat away from the PCBs. The PCBs are removably secured through a clamping mechanism that may be a screw type or cam lever action by clamping down on the exposed card edges, thus allowing thermal transfer to begin on all cards. The apparatus may be used with any enclosure requiring thermal transfer from PCBs to the enclosure, including cages and enclosures that may or may not use forced airflow (fans or blowers) for heat dissipation.

Abstract: A mechanical set of plates is able to simultaneously and quickly removably secure and remove one or more printed circuit boards (PCBs) in an enclosure in one single motion, and act as a heat sink to conduct heat away from the PCBs. The PCBs are removably secured through a clamping mechanism that may be a screw type or cam lever action by clamping down on the exposed card edges, thus allowing thermal transfer to begin on all cards. The apparatus may be used with any enclosure requiring thermal transfer from PCBs to the enclosure, including cages and enclosures that may or may not use forced airflow (fans or blowers) for heat dissipation.

Abstract: A cabinet which utilizes an air-to-air heat exchanger to remove heat generated from within the cabinet prevents water and dust from entering the air-to-air heat exchanger by forcing cooler external air up along a first side wall, through the air-to-air heat exchanger, and down along a second side wall.

Abstract: The efficiency of a heat exchanger is significantly improved by forming walls in an air flow structure, which has first grooves formed in the top surface of the structure and second grooves formed in the bottom surface of the structure, that block off alternating ends of the first and second grooves such that a first air source can only flow through the first grooves and a second air source can only flow through the second grooves.

Abstract: The efficiency of a heat exchanger is significantly improved by connecting walls to an air flow structure, which has first grooves formed in the top surface of the structure and second grooves formed in the bottom surface of the structure, that block off alternating ends of the first and second grooves such that a first air source can only flow through the first grooves and a second air source can only flow through the second grooves.

Abstract: The efficiency of a heat exchanger is significantly improved by forming walls in an air flow structure, which has first grooves formed in the top surface of the structure and second grooves formed in the bottom surface of the structure, that block off alternating ends of the first and second grooves such that a first air source can only flow through the first grooves and a second air source can only flow through the second grooves.