Patents by Inventor Lawrence M. PALANUK

Lawrence M. PALANUK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and devices for securing and transporting singulated die in high volume manufacturing
    Patent number: 9929031
    Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: March 27, 2018
    Assignee: INTEL CORPORATION
    Inventors: John C. Johnson, Eric J. Moret, Lawrence M. Palanuk, Gregory A. Stone
  • METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN HIGH VOLUME MANUFACTURING
    Publication number: 20170032991
    Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
    Type: Application
    Filed: October 17, 2016
    Publication date: February 2, 2017
    Inventors: John C. JOHNSON, Sandeep B. SANE, Sandeep RAZDAN, Edward R. PRACK, Leonel R. ARANA, Peter A. DAVISON, Eric J. MORET, Lawrence M. PALANUK, Gregory A. STONE
  • Methods and devices for securing and transporting singulated die in high volume manufacturing
    Patent number: 9496161
    Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: November 15, 2016
    Assignee: INTEL CORPORATION
    Inventors: John C. Johnson, Eric J. Moret, Lawrence M. Palanuk, Gregory A. Stone
  • METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN HIGH VOLUME MANUFACTURING
    Publication number: 20160172222
    Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
    Type: Application
    Filed: February 22, 2016
    Publication date: June 16, 2016
    Inventors: John C. JOHNSON, Sandeep B. SANE, Sandeep RAZDAN, Edward R. PRACK, Leonel R. ARANA, Peter A. DAVISON, Eric J. MORET, Lawrence M. PALANUK, Gregory A. STONE
  • Methods and devices for securing and transporting singulated die in high volume manufacturing
    Patent number: 9305816
    Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 28, 2013
    Date of Patent: April 5, 2016
    Assignee: INTEL CORPORATION
    Inventors: John C. Johnson, Peter A. Davison, Eric J. Moret, Lawrence M. Palanuk, Gregory A. Stone
  • METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN HIGH VOLUME MANUFACTURING
    Publication number: 20150187622
    Abstract: A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
    Type: Application
    Filed: December 28, 2013
    Publication date: July 2, 2015
    Inventors: John C. JOHNSON, Sandeep B. SANE, Sandeep RAZDAN, Edward R. PRACK, Leonel R. ARANA, Peter A. DAVISON, Eric J. MORET, Lawrence M. PALANUK, Gregory A. STONE