Patents by Inventor Lawrence M. Rosenberg
Lawrence M. Rosenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7303467Abstract: A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending over the platen, and is configured to incrementally advance the polishing sheet in a linear direction relative to the platen. The chucking mechanism is configured to intermittently secure the portion of the polishing sheet to the platen.Type: GrantFiled: September 12, 2006Date of Patent: December 4, 2007Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Lawrence M. Rosenberg, Sasson Somekh, John M. White
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Patent number: 7104875Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.Type: GrantFiled: May 3, 2004Date of Patent: September 12, 2006Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Sandra L. Rosenberg, legal representative, Sasson Somekh, John M White, Lawrence M. Rosenberg, deceased
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Patent number: 7014538Abstract: A method and apparatus for using fixed abrasive polishing pads that contain posts for chemical mechanical polishing (CMP). The posts have different shapes, different sizes, different heights, different materials, different distribution of abrasive particles and different process chemicals. This invention also includes preconditioning fixed abrasive articles comprising a plurality of posts so that the posts have equal heights above the backing to achieve a uniform texture. This invention relates to improvements with respect to in situ rate measurement (ISRM) devices. The invention resides in providing a mechanical means, such as a notch, to determine when approaching the end of the abrasive web roll. The invention resides in coding the web throughout its length to enable determining the location of different portions of the web. This invention resides in providing perforations in the sides or end of the web for improved handling.Type: GrantFiled: March 5, 2003Date of Patent: March 21, 2006Assignee: Applied Materials, Inc.Inventors: James V. Tietz, Shijian Li, Manoocher Birang, John M. White, Sandra L. Rosenberg, legal representative, Marty Scales, Ramin Emami, Lawrence M. Rosenberg, deceased
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Patent number: 6951511Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.Type: GrantFiled: October 17, 2002Date of Patent: October 4, 2005Assignee: Applied Materials Inc.Inventors: Jayakumar Gurusamy, Gee Sun Hoey, Lawrence M. Rosenberg
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Publication number: 20040209559Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.Type: ApplicationFiled: May 3, 2004Publication date: October 21, 2004Applicant: Applied Materials, a Delaware corporationInventors: Manoocher Birang, Lawrence M. Rosenberg, Sandra L. Rosenberg, Sasson Somekh, John M. White
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Publication number: 20040209556Abstract: A substrate is maintained beneath a substrate mounting surface with a retaining ring that includes a generally annular lower portion having a bottom surface for contacting the polishing surface during polishing, and a generally annular upper portion having a bottom surface joined to the lower portion and a top surface fixed to and abutting the base. The lower portion is made of a plastic and the upper lower portion is made of a metal which is more rigid than the plastic.Type: ApplicationFiled: April 15, 2004Publication date: October 21, 2004Applicant: Applied Materials, Inc., a Delaware corporationInventors: Steven M. Zuniga, Thomas H. Osterheld, Lawrence M. Rosenberg
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Patent number: 6729944Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.Type: GrantFiled: June 17, 2002Date of Patent: May 4, 2004Assignee: Applied Materials Inc.Inventors: Manoocher Birang, Lawrence M Rosenberg, Sasson R Somekh, John M White
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Publication number: 20040082288Abstract: A method and apparatus for using fixed abrasive polishing pads that contain posts for chemical mechanical polishing (CMP). The posts have different shapes, different sizes, different heights, different materials, different distribution of abrasive particles and different process chemicals. This invention also includes preconditioning fixed abrasive articles comprising a plurality of posts so that the posts have equal heights above the backing to achieve a uniform texture. This invention relates to improvements with respect to in situ rate measurement (ISRM) devices. The invention resides in providing a mechanical means, such as a notch, to determine when approaching the end of the abrasive web roll. The invention resides in coding the web throughout its length to enable determining the location of different portions of the web. This invention resides in providing perforations in the sides or end of the web for improved handling.Type: ApplicationFiled: March 5, 2003Publication date: April 29, 2004Applicant: APPLIED MATERIALS, INC.Inventors: James V. Tietz, Shijian Li, Manoocher Birang, John M. White, Lawrence M. Rosenberg, Marty Scales, Ramin Emami, Sandra L. Rosenberg
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Publication number: 20030060143Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.Type: ApplicationFiled: June 17, 2002Publication date: March 27, 2003Applicant: Applied Materials, Inc.Inventors: Manoocher Birang, Lawrence M. Rosenberg, Sasson Somekh, John M. White, Sandra M. Rosenberg
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Publication number: 20030060134Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.Type: ApplicationFiled: October 17, 2002Publication date: March 27, 2003Applicant: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Gee Sun Hoey, Lawrence M. Rosenberg
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Patent number: 6482072Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.Type: GrantFiled: October 26, 2000Date of Patent: November 19, 2002Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Gee Sun Hoey, Lawrence M. Rosenberg
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Patent number: 6413873Abstract: A semiconductor substrate processing system for polishing a substrate that generally includes a platen and a web of polishing material disposed thereon. Embodiments of the system include a disposable cartridge for housing the web of polishing material, a shield member disposed proximate the web for preventing contamination of the unused portion of the web, a fluid delivery for fixing and freeing the web from the platen, apparatus for controlling the lateral movement of the web, and an apparatus for providing more linear feet of polishing material per height of a roll.Type: GrantFiled: May 3, 2000Date of Patent: July 2, 2002Assignee: Applied Materials, Inc.Inventors: Shijian Li, John M. White, Lawrence M. Rosenberg, Martin Scales, Ramin Emami, James V. Tietz, Manoocher Birang
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Patent number: 6379231Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.Type: GrantFiled: June 20, 2000Date of Patent: April 30, 2002Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Lawrence M. Rosenberg, Sasson Somekh, John M. White
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Patent number: 6361423Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.Type: GrantFiled: December 22, 2000Date of Patent: March 26, 2002Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg
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Patent number: 6299511Abstract: A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.Type: GrantFiled: January 21, 2000Date of Patent: October 9, 2001Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg, Alexander Medvinsky
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Patent number: 6251215Abstract: A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.Type: GrantFiled: June 3, 1998Date of Patent: June 26, 2001Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Thomas H. Osterheld, Lawrence M. Rosenberg
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Patent number: 6244935Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.Type: GrantFiled: February 4, 1999Date of Patent: June 12, 2001Assignee: Applied Materials, Inc.Inventors: Manoocher Birang, Lawrence M. Rosenberg, Sasson Somekh, John M White
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Publication number: 20010001301Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.Type: ApplicationFiled: December 22, 2000Publication date: May 17, 2001Applicant: Applied Materials, Inc.,Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg
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Patent number: 6200199Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.Type: GrantFiled: March 31, 1998Date of Patent: March 13, 2001Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg
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Patent number: 6033290Abstract: A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.Type: GrantFiled: September 29, 1998Date of Patent: March 7, 2000Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg, Alexander Medvinsky