Abstract: A press pad for bonding substrates into a radio-frequency and/or intermediate-frequency module. The module has a plurality of channels, each of which has an adhesive film for bonding the substrate. The press pad has a pad body conformal to the substrate and pairs of lateral protrusions extending from central axes of opposing surfaces of the pad body. The protrusions are in the forms of semicircular bumps or fins extending perpendicular to the opposing surfaces. Therefore, the lateral extent of the press pad within the channel is minimized, such that the misalignment and inclination of the press pad is minimized. Further, the lateral protrusions are fabricated from material operative to resist lateral pressure, such that deformation of the press pad caused by lateral pressure is also prevented. Therefore, pressure gradient and pressure loss are prevented.

Abstract: A method is provided for manufacturing electronic module assemblies comprising a plurality of substrates and a housing.