Abstract: In accordance with the invention a chip packaging structure and technique is arranged in which multiple surfaces of the semiconductor chip are surrounded in a pocket in a module with direct transfer thermally conductive materials. The chip packaging module consists of a thermally conductive plate and cover which together form a thermally conductive pocket or shell around the chip. The pocket inside the shell is filled with thermally conductive paste-like materials which are compressed under spring forces. The direct thermal transfer is achieved using thermal transfer plates of such materials such as silicon, diamond-like, or copper-invar-copper plates on all six sides.

Abstract: A Method and system are disclosed for accessing personal Web site or executing electronic commerce with security in a smart Java card. A personal Web site which includes personal or private information is stored in a personal smart Java card. Before a user can access the Web site stored in the smart Java card, the user is validated by any one of or in combination of PIN, facial images, hand images, eye image, voice characteristics, and finger prints. In addition, an encryption engine embedded in the smart Java card decodes and compares the entered PIN combined with a secure key or security certificate to verify the identity of the user. Before the bank account can be accessed freely by the user, the bank's computer system checks the combined secure data to ensure the authenticity of the card and the user's identity with multiple check points using Internet security protocols via Web browsers.