Abstract: A method for accurately depositing a continuous and homogeneous line of a minute, metered volume of solder to a delineated area of an electronic component comprises positioning over said area a template made of high temperature withstanding material such as high density graphite and having a series of spaced-apart bores joined at their base by a groove defining said line. Particles of solder having a cumulative size corresponding to said volume are inserted into the bores. The component and template assembly is then subjected to solder-melting temperature under a control atmosphere, causing the solder to flow and evenly deposit on the targeted area.