Abstract: A process for preparing a chrome substrate for application of a polymer coating, wherein the substrate preparation enhances adhesion and durability of the adhesion between the chrome substrate and the polymer coating, involves contacting the chrome substrate with an acid solution for a period of time sufficient to modify the surface of the chrome substrate. In certain embodiments, the acid treatment is an anodic treatment. In accordance with certain aspects of this invention, the acid treated chrome surface is further treated with a silane compound to enhance adhesion with a subsequently applied polymer coating composition.

Abstract: A processing rack, such as for electroplating, which minimizes shelf areas of an article during processing of the article and during removal of the article from a processing bath and which allows easy mounting of articles on the rack and demounting of articles from the rack includes a frame and a plurality of article mounting fixtures that are each pivotally mounted on the frame and independently pivotable from a first orientation that facilitates mounting and/or demounting of articles, to a second orientation that is most conducive to producing high quality, substantially defect-free plating.

Abstract: A tool for electroplating a portion of the surface of each of a plurality of pieces includes a first plate having a plurality of holes, and a second plate having a plurality of retaining elements. Each of the holes is configured to receive a piece that is to be electroplated, and to mask a portion of the surface and expose another portion of the surface of the piece. The first and second plates are held together, and a mechanism is provided for shifting one of the plates with respect to the other between a first orientation in which the retaining elements are disengaged from pieces received in the holes and a second orientation in which the retaining elements are engaged with pieces received in the holes. This arrangement allows the pieces to be quickly and easily retained for an electroplating operation and released after the electroplating operation.

Abstract: A processing rack, such as for electroplating, which minimizes shelf areas of an article during processing of the article and during removal of the article from a processing bath and which allows easy mounting of articles on the rack and demounting of articles from the rack includes a frame and a plurality of article mounting fixtures that are each pivotally mounted on the frame and independently pivotable from a first orientation that facilitates mounting and/or demounting of articles, to a second orientation that is most conducive to producing high quality, substantially defect-free plating.

Abstract: A process for preparing a chrome substrate for application of a polymer coating, wherein the substrate preparation enhances adhesion and durability of the adhesion between the chrome substrate and the polymer coating, involves contacting the chrome substrate with an acid solution for a period of time sufficient to modify the surface of the chrome substrate. In certain embodiments, the acid treatment is an anodic treatment. In accordance with certain aspects of this invention, the acid treated chrome surface is further treated with a silane compound to enhance adhesion with a subsequently applied polymer coating composition.

Abstract: A process of selectively plating a metal pattern on the surface of a plastic component allows intricate and/or fine patterns of metal to be precisely electroplated onto either a two-dimensional or three-dimensional contoured surface of a plastic article or substrate. The selective metal plating may be either a decorative pattern or a functional pattern, such as for an electrical circuit. The process generally comprises electrolessly depositing a metal coating on the surface of a plastic component, depositing a photoresist coating over the electrolessly deposited metal, imaging and developing the photoresist coating to form a desired patterned photoresist, electroplating a metal on the electrolessly deposited metal that is exposed through the developed photoresist pattern, and stripping the cured photoresist coating and electrolessly deposited metal underneath the cured photoresist coating without damaging the decorative or functional electroplating.

Abstract: A process for forming a decorative chromium plating on a plastic substrate includes depositing an electrically conductive coating on the plastic substrate, electrodepositing on the electrically conductive coating a high leveling semi-bright nickel electroplate layer, electrodepositing on the high leveling semi-bright nickel electroplate layer a bright nickel electroplate layer, and electrodepositing over the bright nickel electroplate layer a chromium electroplate layer. An advantage of the process is that a lustrous decorative chromium plating having good corrosion resistance and thermal cycling characteristics is obtained without a copper sublayer, and while using relatively thin nickel sublayers.

Abstract: A process for controlling the micelle size distribution of an alkylene oxide dispersion in a nickel-plating electrolyte is used to maintain the electrolyte in a condition suitable for producing nickel coatings having a uniform satin finish in which finish characteristics such as roughness depth are maintained within desired limits. The process involves steps of removing a portion of the electrolyte from the electroplating bath, filtering the alkylene oxide from the electrolyte removed from the electroplating bath, adding alkylene oxide to the electroplating bath, and returning the filtered electrolyte to the electroplating bath. The process removes larger alkylene oxide micelles from the electrolyte and replaces them with smaller micelles to maintain a desired micelle size distribution.

Abstract: Polyamide substrates are pre-conditioned for electroless plating by contact with an aqueous alkaline solution having a pH of at least about 10 and etched with an aqueous acid etch solution of an organic acid containing at least two carbon atoms, in combination with from 1 to 10 percent by weight of an inorganic acid which is nondeleteriously reactive with the organic acid. Trichloroacetic acid is the preferred organic acid and sulfuric, hydrochloric and/or nitric the preferred inorganic acids. Contact with the aqueous alkaline solution can be eliminated where the polyamide is caprolactam.

Abstract: Filled polyester substrates are conditioned for electroless plating by contact with an alkaline conditioner having a pH of at least 8, followed by contact with an aqueous acid fluoride etch solution having a pH less than about 5 and a fluoride concentration of at least 1 mole per liter of solution.

Abstract: Filled polycarbonate resin substrates are conditioned for electroless plating by contact with an alkaline conditioner having a pH of at least 8, followed by contact with an aqueous acid fluoride etch solution having a pH less than about 5 and a fluoride concentration of at least 1 mole per liter of solution.

Abstract: Polyamide substrates are pre-conditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an aqueous acid etch solution. The aqueous acid etch solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloroacetic acid.

Abstract: Caprolactam polymeric substrates are conditioned for electroless plating by etching with an aqueous solution of organic acid containing from 2 to 4 carbon atoms, preferably an acetic acid compound, such as trichloroacetic acid.

Abstract: Mixtures of water with water soluble and/or miscible halogenated compounds are used to pre-etch polysulfone and other polymers such as polyesters and polycarbonates to induce or improve adhesion of metals deposited by electroless plating processes.

Abstract: Water soluble salts of metals other than the noble metals, such as copper and nickel salts, are converted in the presence of a water soluble suspending agent to suspensions of water insoluble catalytic particles which are absorbable onto the surface of nonconductors to permit electroless plating of the surfaces.