Patents by Inventor Lawrence P. Lehman
Lawrence P. Lehman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7703199Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.Type: GrantFiled: May 24, 2006Date of Patent: April 27, 2010Assignee: International Business Machines CorporationInventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
-
Patent number: 7086147Abstract: Solder balls such as, low melt C4 solder balls, undergo volume expansion during reflow, such as may occur during attachment of chip modules to a PCB. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodated this volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.Type: GrantFiled: January 29, 2004Date of Patent: August 8, 2006Assignee: International Business Machines CorporationInventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
-
Publication number: 20040183094Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.Type: ApplicationFiled: January 29, 2004Publication date: September 23, 2004Applicant: International Business Machines CorporationInventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
-
Patent number: 6686664Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.Type: GrantFiled: April 30, 2001Date of Patent: February 3, 2004Assignee: International Business Machines CorporationInventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
-
Patent number: 6649833Abstract: An electronic package is provided including a substrate, a device mounted on the substrate, and a solder member electrically coupling the device to the substrate. The package includes a dielectric material positioned substantially around the solder member which forms a physical connection between the substrate and the device. The volume of the solder member contracts during melting thereof to prevent failure of the physical connection and/or the electrical coupling between the substrate and the device.Type: GrantFiled: August 9, 2002Date of Patent: November 18, 2003Assignee: International Business Machines CorporationInventors: David V. Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel
-
Patent number: 6639661Abstract: A congruence between the element that provides an electrical conductive path in a component of micron dimensions and an imaging of that element provides a basis for predicting the effectiveness and the consistency in the functioning of the element in an actual operating environment. The element is formed first into a sandwich whereby the operating end is deformed against a light transparent surface. By directing a beam of light into the end of that light transparent surface, the asperity of the operating end produces a light scattering effect that is imaged by microscopic optics that is located facing the operating end.Type: GrantFiled: January 8, 2001Date of Patent: October 28, 2003Assignee: International Business Machines CorporationInventors: William L. Brodsky, Lawrence P. Lehman, Daniel C. Van Hart
-
Patent number: 6626196Abstract: An arrangement and method for the degassing small high-aspect ratio drilled holes or vias which are present in panels such as printed circuit boards prior to wet chemical processing, including copper plating of the vias, in order to remove any air or gas bubbles from the vias tending to inhibit the reliable plating thereof. This is carried out through the utilization of an ultrasonic prewetting in a liquid bath preceding cleaning for the electroless plating process, thereby enabling all of the vias or holes to be degassed; in effect, having air removed and the vias or holes filled with liquid; thereby allowing subsequent process cleansing solutions to easily flow into the respective holes or vias in order to facilitate the electroless copper plating process.Type: GrantFiled: June 15, 2001Date of Patent: September 30, 2003Assignee: International Busines Machines CorporationInventors: Francis J. Downes, Jr., Raymond T. Galasco, Lawrence P. Lehman, Robert D. Topa
-
Publication number: 20020189637Abstract: An arrangement and method for the degassing small high-aspect ratio drilled holes or vias which are present in panels such as printed circuit boards prior to wet chemical processing, including copper plating of the vias, in order to remove any air or gas bubbles from the vias tending to inhibit the reliable plating thereof This is carried out through the utilization of an ultrasonic prewetting in a liquid bath preceding cleaning for the electroless plating process, thereby enabling all of the vias or holes to be degassed; in effect, having air removed and the vias or holes filled with liquid; thereby allowing subsequent process cleansing solutions to easily flow into the respective holes or vias in order to facilitate the electroless copper plating process.Type: ApplicationFiled: June 15, 2001Publication date: December 19, 2002Applicant: International Business MachinesInventors: Francis J. Downes, Raymond T. Galasco, Lawrence P. Lehman, Robert D. Topa
-
Publication number: 20020158110Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.Type: ApplicationFiled: April 30, 2001Publication date: October 31, 2002Applicant: International Business Machines CorporationInventors: David Vincent Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George Henry Thiel
-
Publication number: 20020089663Abstract: A congruence between the element that provides an electrical conductive path in a component of micron dimensions and an imaging of that element provides a basis for predicting the effectiveness and the consistency in the functioning of the element in an actual operating environment. The element is formed first into a sandwich whereby the operating end is deformed against a light transparent surface. By directing a beam of light into the end of that light transparent surface, the asperity of the operating end produces a light scattering effect that is imaged by microscopic optics that is located facing the operating end.Type: ApplicationFiled: January 8, 2001Publication date: July 11, 2002Inventors: William L. Brodsky, Lawrence P. Lehman, Daniel C. Van Hart
-
Patent number: 6228246Abstract: A method of removing a metal skin from a through-hole surface of a copper-Invar-copper (CIC) laminate without causing differential etchback of the laminate. The metal skin includes debris deposited on the through-hole surface as the through hole is being formed by laser or mechanical drilling of a substrate that includes the laminate as an inner plane. Removing the metal skin combines electrochemical polishing (ECP) with ultrasonics. ECP dissolves the metal skin in an acid solution, while ultrasonics agitates and circulates the acid solution to sweep the metal skin out of the through hole. ECP is activated when a pulse power supply is turned on and generates a periodic voltage pulse from a pulse power supply whose positive terminal is coupled to the laminate and whose negative terminal is coupled to a conductive cathode. After the metal skin is removed, the laminate is differentially etched such that the copper is etched at a faster rate than the Invar.Type: GrantFiled: July 1, 1999Date of Patent: May 8, 2001Assignee: International Business Machines CorporationInventors: Madhav Datta, Raymond T. Galasco, Lawrence P. Lehman, Roy H. Magnuson, Robin A. Susko, Robert D. Topa