Abstract: Curemeter and method in which UV exposure is monitored by a portable data collection module and data from the module is processed by a docking station which is located remotely from the site where the UV radiation is present. Temperature is also monitored at the data collection module, and the UV exposure data is compensated for variations in temperature. The data collection module includes shielding and filters to protect the UV detector from the harsh environment in which the UV readings are taken and to limit the radiation impinging upon the detector to the desired spectrum. Programmable thresholds for the detector signals protect against the collection of spurious data.

Abstract: A wafer handler arm conveys a wafer from a horizontal orientation to a vertical orientation for wafer processing. The arm includes a wafer holding member which is rigidly attached to a first shaft. The first shaft is rotatable about its longitudinal axis and the first shaft is rotatable about a second axis perpendicular to the first axis.

Abstract: A modular wafer processing machine is provided which is based on interconnected handling units having wafer handling arms. Each unit can pass a wafer to another unit in the same vacuum environment to a processing module.

Abstract: A machine for sputter deposition of a wafer workpiece also sputters on the wafer supporting mechanism. This causes a need for cleaning or replacement of the support mechanism. A sputter machine is provided in which the supporting mechanism can be isolated from the sputtering source, the pumps and other processing apparatus for cleaning without exposing the entire machine to atmosphere.