Patents by Inventor Lawrence R. Thompson

Lawrence R. Thompson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame with included passive devices
    Patent number: 7489021
    Abstract: An semiconductor device package (10) includes a semiconductor device (die) (12) and passive devices (14) electrically connected to a common lead frame (17). The lead frame (17) is formed from a stamped and/or etched metallic structure and includes a plurality of conductive leads (16) and a plurality of interposers (20). The passive devices (14) are electrically connected to the interposers (20), and I/O pads (22) on the die (12) are electrically connected to the leads (16). The die (12), passive devices (14), and lead frame (17) are encapsulated in a molding compound (28), which forms a package body (30). Bottom surfaces (38) of the leads (16) are exposed at a bottom face (34) of the package (10).
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: February 10, 2009
    Assignee: Advanced Interconnect Technologies Limited
    Inventors: Frank J. Juskey, Daniel K. Lau, Lawrence R. Thompson
  • Lead Frame with Included Passive Devices
    Publication number: 20080036034
    Abstract: An semiconductor device package (10) includes a semiconductor device (die) (12) and passive devices (14) electrically connected to a common lead frame (17). The lead frame (17) is formed from a stamped and/or etched metallic structure and includes a plurality of conductive leads (16) and a plurality of interposers (20). The passive devices (14) are electrically connected the interposers (20), and I/O pads (22) on the die (12) are electrically connected to the leads (16). The die (12), passive devices (14), and lead frame (17) are encapsulated in a molding compound (28), which forms a package body (30). Bottom surfaces (38) of the leads (16) are exposed at a bottom face (34) of the package (10).
    Type: Application
    Filed: February 17, 2004
    Publication date: February 14, 2008
    Inventors: Frank J. Juskey, Daniel K. Lau, Lawrence R. Thompson