Abstract: An advanced semiconductor package substrate with crosstalk mitigation structures and methods of developing the same are provided. More particularly, methods and apparatus in an integrated circuit to mitigate crosstalk between signal traces disposed in a common layout plane of an advanced package are provided. Mitigation structures may be formed by providing at least one reference trace which substantially conforms to the path of that signal trace, essentially following the path of least impedance of the high frequency signal excitation.

Abstract: Embodiments disclosed herein include package architectures. In an embodiment, the package architecture comprises a package substrate, a first bridge in the package substrate, where the first bridge includes conductive routing, and a second bridge in the package substrate. In an embodiment, the package architecture further comprises a third bridge in the package substrate, where the second bridge and the third bridge are positioned symmetrically about the first bridge.

Abstract: Aspects of the invention related to a system for providing advance notice of impending contact between a stationary component and a rotating component in a turbine engine. For example, the system can be used to warn of potential contact between a seal holder and a rotor disk in the compressor section of the engine. In one embodiment, a pad or other component can be provided on the stationary seal holder. If the seal holder and the rotor disk approach each other during operation, the pad can contact the rotor disk prior to actual contact between the seal holder and the rotor disk. An optical and/or an acoustic signal can be generated by such contact. The signals can be detected remotely from the point of contact by a signal detection device, thereby avoiding the need to pass wires through the compressor section.