Patents by Inventor Lawrence Shungwei Mok
Lawrence Shungwei Mok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20090113226Abstract: A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode. When the portable computer is operated as a stand-alone computer, it operates in the low power mode. When the portable computer is operated while electrically connected to the docking station, it operates in a high power mode. The docking station has greater cooling capacity than the portable computer alone to provide enhanced cooling of the high power mode of operation.Type: ApplicationFiled: December 22, 2008Publication date: April 30, 2009Inventors: Lawrence Shungwei Mok, Daniel Peter Morris
-
Publication number: 20090113224Abstract: A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode. When the portable computer is operated as a stand-alone computer, it operates in the low power mode. When the portable computer is operated while electrically connected to the docking station, it operates in a high power mode. The docking station has greater cooling capacity than the portable computer alone to provide enhanced cooling of the high power mode of operation.Type: ApplicationFiled: December 22, 2008Publication date: April 30, 2009Inventors: Lawrence Shungwei Mok, Daniel Peter Morris
-
Publication number: 20090113105Abstract: A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode. When the portable computer is operated as a stand-alone computer, it operates in the low power mode. When the portable computer is operated while electrically connected to the docking station, it operates in a high power mode. The docking station has greater cooling capacity than the portable computer alone to provide enhanced cooling of the high power mode of operation.Type: ApplicationFiled: December 26, 2008Publication date: April 30, 2009Inventors: Lawrence Shungwei Mok, Daniel Peter Morris
-
Publication number: 20090077296Abstract: A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode. When the portable computer is operated as a stand-alone computer, it operates in the low power mode. When the portable computer is operated while electrically connected to the docking station, it operates in a high power mode. The docking station has greater cooling capacity than the portable computer alone to provide enhanced cooling of the high power mode of operation.Type: ApplicationFiled: November 5, 2008Publication date: March 19, 2009Inventors: Lawrence Shungwei Mok, Daniel Peter Morris
-
Patent number: 7472215Abstract: A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode. When the portable computer is operated as a stand-alone computer, it operates in the low power mode. When the portable computer is operated while electrically connected to the docking station, it operates in a high power mode. The docking station has greater cooling capacity than the portable computer alone to provide enhanced cooling of the high power mode of operation.Type: GrantFiled: March 31, 1999Date of Patent: December 30, 2008Assignee: International Business Machines CorporationInventors: Lawrence Shungwei Mok, Daniel Peter Morris
-
Publication number: 20080177613Abstract: A method and system of predicting a maintenance schedule and estimating a cost for warranty service of systems, for example, hardware systems, is provided. The method and system in one aspect may collect component usage data and obtain component reliability data for each of the plurality of components. A component life distribution module (CLDM) may be constructed based on the real time component usage data and the component reliability data, and from CLDM a mean time to fail data may be obtained. A system life distribution model (SLDM) may be selected and the mean time to fail data input into the SLDM to obtain an operating environment index that represents the effect of environment conditions on the lifetime and reliability. A maintenance schedule may be predicted and an adjusted cost of warranty service may be calculated based on the operating environment index for each of the plurality of components.Type: ApplicationFiled: January 19, 2007Publication date: July 24, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hoi Yeung Chan, Trieu Can Chieu, Lawrence Shungwei Mok
-
Patent number: 7134484Abstract: A two loop heat conversion system for high heat density planar devices in which high density heat in an area adjacent to a surface is transferred into a liquid cooling medium closed loop in a radiated heat to liquid heat transfer component positioned in contact with the surface that is connected, to a liquid to gas medium, heat exchanger in a first loop and a gas medium second loop is arranged to carry away all radiated heat from the assembly and all heat extracted from the liquid in the liquid to gas heat exchanger and exhaust it to the ambient. The radiated heat transfer component of the invention provides a transition in manufacturing that is practiced employing the planar type tools in fabrication which usually can neither be practiced manually or observed without substantial magnification.Type: GrantFiled: December 7, 2000Date of Patent: November 14, 2006Assignee: International Business Machines CorporationInventors: Lawrence Shungwei Mok, Tsorng-Dih Yuan
-
Patent number: 7079394Abstract: A cooling device for a chip in a portable computer that uses a horizontal flat fan in the corner of a portable computer housing with air outlets through heatsinks that enhance exhaust air flow over heat pipes from the chip and out through the computer housing. The exhaust is through the adjacent vertical walls of the computer housing. Separate heat pipes go directly from the chip to fins located at the outlet at the wall.Type: GrantFiled: January 8, 2003Date of Patent: July 18, 2006Assignee: Lenovo (Singapore) Pte. Ltd.Inventor: Lawrence Shungwei Mok
-
Patent number: 6909602Abstract: A system, includes a user input device, a temperature changing unit coupled to the user input device, and a controller, coupled to the temperature changing unit, for controlling the temperature of the user input device.Type: GrantFiled: May 24, 2002Date of Patent: June 21, 2005Assignee: International Business Machines CorporationInventors: Brenda Lynn Dietrich, Lawrence Shungwei Mok, Clifford Alan Pickover
-
Patent number: 6892800Abstract: The invention provides a structural principle wherein a combination fan-heatsink type cooling device transfers a large amount of heat into an ambient while producing minimal acoustic noise. The fan-heatsink has top and bottom cover members with a central power shaft between them, the shaft has fins that rotate around the shaft between the covers to move ambient. The ambient enters the fan-heatsink through inlets through the covers near the central power shaft and is forced out through louvers that make up the peripheral of the fan-heatsink housing. The fan-heatsink cooling device is positioned so that heat radiating from the heat source such as a chip enters the housing through the inlets near the central shaft and heat pipes are arranged to carry heat from the chip source to and through the louvers so that the ambient forced through the louvers absorbs heat transferred to the louvers at the place where it is immediately carried out of the fan-heatsink structure.Type: GrantFiled: December 31, 2002Date of Patent: May 17, 2005Assignee: International Business Machines CorporationInventor: Lawrence Shungwei Mok
-
Publication number: 20040129409Abstract: The invention provides a structural principle wherein a combination fan-heatsink type cooling device transfers a large amount of heat into an ambient while producing minimal acoustic noise. The fan-heatsink has top and bottom cover members with a central power shaft between them, the shaft has fins that rotate around the shaft between the covers to move ambient. The ambient enters the fan-heatsink through inlets through the covers near the central power shaft and is forced out through louvers that make up the peripheral of the fan-heatsink housing. The fan-heatsink cooling device is positioned so that heat radiating from the heat source such as a chip enters the housing through the inlets near the central shaft and heat pipes are arranged to carry heat from the chip source to and through the louvers so that the ambient forced through the louvers absorbs heat transferred to the louvers at the place where it is immediately carried out of the fan-heatsink structure.Type: ApplicationFiled: December 31, 2002Publication date: July 8, 2004Inventor: Lawrence Shungwei Mok
-
Patent number: 6681840Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.Type: GrantFiled: January 7, 2002Date of Patent: January 27, 2004Assignee: International Business Machines CorporationInventor: Lawrence Shungwei Mok
-
Publication number: 20040011507Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.Type: ApplicationFiled: January 7, 2002Publication date: January 22, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Lawrence Shungwei Mok
-
Publication number: 20030218862Abstract: A system, includes a user input device, a temperature changing unit coupled to the user input device, and a controller, coupled to the temperature changing unit, for controlling the temperature of the user input device.Type: ApplicationFiled: May 24, 2002Publication date: November 27, 2003Applicant: International Business Machines CorporationInventors: Brenda Lynn Dietrich, Lawrence Shungwei Mok, Clifford Alan Pickover
-
Patent number: 6507488Abstract: A computer which possesses a bottom keyboard housing having a rear edge hingedly connected with the lower edge of an openable display assembly, and wherein heat-generating computer electronics contained in the housing has heat removed therefrom through the intermediary of heat pipes which are hingedly connected with at least one heat dissipator located in the display assembly. In essence, the computer incorporates an inexpensive construction of heat pipe hinges employed in the thermal interconnection of the bottom keyboard housing of the portable personal computer containing the keyboard and electronics with the display assembly, wherein the heat pipes are protected from bending stresses prior to assembling the major portions of the portable personal computer, such as the keyboard housing and the display assembly.Type: GrantFiled: April 30, 1999Date of Patent: January 14, 2003Assignee: International Business Machines CorporationInventors: Thomas Mario Cipolla, Lawrence Shungwei Mok
-
Patent number: 6504917Abstract: A call path display telephone system includes an establishment telephone and a user telephone. The establishment telephone includes a memory, communication module and controller. The user telephone includes a memory, microphone, speaker, keypad, communication module, controller, and a visual input/output module. The desired menu options for a call path are visually displayed to a user to allow the user to more rapidly and efficiently navigate through the call path menu. Unlike prior-art voice based systems, it is not necessary to sequentially listen to all available options; they can be rapidly viewed visually and selected as desired.Type: GrantFiled: April 29, 1999Date of Patent: January 7, 2003Assignee: International Business Machines CorporationInventors: Ephraim Bemis Flint, Lawrence Shungwei Mok, Modest Michael Oprysko
-
Patent number: 6428886Abstract: A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a substrate which has a first surface subject to handling. There is then formed upon the first surface of the substrate a coating. The coating has an optimal density, an optimal thermal conductivity and an optimal thickness such that when the substrate having the coating formed thereupon is equilibrated at a non-body temperature differing from a body temperature and the coating is subsequently contacted with a body at the body temperature during handling, the temperature of the surface of the coating at a contact point of the body with the coating changes precipitously to a temperature near the body temperature and subsequently returns towards the non-body temperature at a rate which permits handling of the coating at the location of the first surface of the substrate by the body with attenuated thermal sensation.Type: GrantFiled: November 7, 1997Date of Patent: August 6, 2002Assignee: International Business Machines CorporationInventors: David Andrew Lewis, Lawrence Shungwei Mok
-
Patent number: 6413623Abstract: A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a substrate which has a first surface subject to handling. There is then formed upon the first surface of the substrate a coating. The coating has an optimal density, an optimal thermal conductivity and an optimal thickness such that when the substrate having the coating formed thereupon is equilibrated at a non-body temperature differing from a body temperature and the coating is subsequently contacted with a body at the body temperature during handling, the temperature of the surface of the coating at a contact point of the body with the coating changes precipitously to a temperature near the body temperature and subsequently returns towards the non-body temperature at a rate which permits handling of the coating at the location of the first surface of the substrate by the body with attenuated thermal sensation.Type: GrantFiled: February 8, 2001Date of Patent: July 2, 2002Assignee: International Business Machines CorporationInventors: David Andrew Lewis, Lawrence Shungwei Mok
-
Publication number: 20020070006Abstract: A two loop heat conversion system for high heat density planar devices in which high density heat in an area adjacent to a surface is transferred into a liquid cooling medium closed loop in a radiated heat to liquid heat transfer component positioned in contact with the surface that is connected, to a liquid to gas medium, heat exchanger in a first loop and a gas medium second loop is arranged to carry away all radiated heat from the assembly and all heat extracted from the liquid in the liquid to gas heat exchanger and exhaust it to the ambient. The radiated heat transfer component of the invention provides a transition in manufacturing that is practiced employing the planar type tools in fabrication which usually can neither be practiced manually or observed without substantial magnification.Type: ApplicationFiled: December 7, 2000Publication date: June 13, 2002Inventors: Lawrence Shungwei Mok, Tsorng-Dih Yuan
-
Patent number: 6352104Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.Type: GrantFiled: October 19, 1999Date of Patent: March 5, 2002Assignee: International Business Machines CorporationInventor: Lawrence Shungwei Mok