Patents by Inventor Lawrence T. Latham

Lawrence T. Latham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulation for particle entrapment
    Patent number: 7473578
    Abstract: A packaged micromechanical device (100) having a blocking material (116) encapsulating debris-generating regions thereof. The blocking material (116) prevents the generation of debris that could interfere with the operation of the micromechanical device (100). Debris-generating regions of the device (100), including debris-creating sidewalls and any debris-harboring cavities, as well as electrical connections (108) linking the device (100) to the package substrate (102) are encapsulated by the blocking material (116). The blocking material (116) avoids contact with any debris-intolerant regions (118) of the device (100). A package lid (122), which is glass in the case of many DMD packages, seals the device (100) in package cavity (120).
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: January 6, 2009
    Assignee: Texas Instruments Incorporated
    Inventors: Edward C. Fisher, Lawrence T. Latham
  • Encapsulation for particle entrapment
    Patent number: 7230325
    Abstract: A packaged micromechanical device (100) having a blocking material (116) encapsulating debris-generating regions thereof. The blocking material (116) prevents the generation of debris that could interfere with the operation of the micromechanical device (100). Debris-generating regions of the device (100), including debris-creating sidewalls and any debris-harboring cavities, as well as electrical connections (108) linking the device (100) to the package substrate (102) are encapsulated by the blocking material (116). The blocking material (116) avoids contact with any debris-intolerant regions (118) of the device (100). A package lid (124), which is glass in the case of many DMD packages, seals the device (100) in a package cavity (120).
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: June 12, 2007
    Assignee: Texas Instruments Incorporated
    Inventors: Edward C. Fisher, Lawrence T. Latham
  • Encapsulation for particle entrapment
    Patent number: 6841412
    Abstract: A packaged micromechanical device (100) having a blocking material (116) encapsulating debris-generating regions thereof. The blocking material (116) prevents the generation of debris that could interfere with the operation of the micromechanical device (100). Debris-generating regions of the device (100), including debris-creating sidewalls and any debris-harboring cavities, as well as electrical connections (108) linking the device (100) to the package substrate (102) are encapsulated by the blocking material (116). The blocking material (116) avoids contact with any debris-intolerant regions (118) of the device (100). A package lid (122), which is glass in the case of many DMD packages, seals the device (100) in a package cavity (120).
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: January 11, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Edward C. Fisher, Lawrence T. Latham