Patents by Inventor Lawrence Thurber

Lawrence Thurber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Controlling adhesives between substrates and carriers
    Patent number: 9579893
    Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: February 28, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
  • CONTROLLING ADHESIVES BETWEEN SUBSTRATES AND CARRIERS
    Publication number: 20160368267
    Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
    Type: Application
    Filed: September 6, 2016
    Publication date: December 22, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
  • Controlling adhesives between substrates and carriers
    Patent number: 9475278
    Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: October 25, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
  • CONTROLLING ADHESIVES BETWEEN SUBSTRATES AND CARRIERS
    Publication number: 20150145908
    Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
    Type: Application
    Filed: June 18, 2012
    Publication date: May 28, 2015
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
  • Stacked adhesive lines
    Patent number: 8863388
    Abstract: A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: October 21, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chris Aschoff, Anthony J. Galvan, Henry Kang, Kelly B. Smith, Lawrence Thurber
  • STACKED ADHESIVE LINES
    Publication number: 20120242757
    Abstract: A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.
    Type: Application
    Filed: March 21, 2011
    Publication date: September 27, 2012
    Inventors: Chris Aschoff, Anthony J. Galvan, Henry Kang, Kelly B. Smith, Lawrence Thurber