Patents by Inventor Lawrence Varnerin

Lawrence Varnerin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7141338
    Abstract: Corner rounding and image shortening is substantially reduced in an image printed on a substrate by illuminating a photolithographic mask and projecting light transmitted through the photolithographic mask onto the substrate using an optical projection system. The photolithographic mask has a mask pattern that includes at least one printable feature having at least one corner. Incorporated, in the mask pattern, is at least one line feature corresponding to the corner of the printable feature. The line feature is in at least close proximity to the corresponding corner of the printable feature and has a line width that is smaller than a minimum resolution of the optical projection system.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: November 28, 2006
    Assignee: Infineon Technologies AG
    Inventors: Xiaochun Linda Chen, Lawrence Varnerin, Bernhard Liegl
  • Publication number: 20050059255
    Abstract: A wafer having a top surface including a first material such as silicon dioxide or silicon nitride and a second material such as polysilicon or copper is etched so as to leave elements formed from the second material projecting above the surrounding surface defined by the first material. An opaque layer may be applied over the newly-formed top surface covered by a transparent layer such as a photoresist. The opaque layer has raised features corresponding to the projecting features formed from the second material. These raised features provide contrast and allow an optical system to locate the wafer as, for example, in registering the wafer in a wafer stepper. Alternatively, transparent layers such as an oxide dielectric and a photoresist may be applied after etching. The projecting elements formed by etching remain visible through the transparent layers and similarly allow optical location.
    Type: Application
    Filed: September 12, 2003
    Publication date: March 17, 2005
    Applicants: Infineon Technologies North America Corp., International Business Machines
    Inventors: Lawrence Varnerin, Zhijian Lu, Qiang Wu
  • Publication number: 20040091790
    Abstract: Corner rounding and image shortening is substantially reduced in an image printed on a substrate by illuminating a photolithographic mask and projecting light transmitted through the photolithographic mask onto the substrate using an optical projection system. The photolithographic mask has a mask pattern that includes at least one printable feature having at least one corner. Incorporated, in the mask pattern, is at least one line feature corresponding to the corner of the printable feature. The line feature is in at least close proximity to the corresponding corner of the printable feature and has a line width that is smaller than a minimum resolution of the optical projection system.
    Type: Application
    Filed: November 12, 2002
    Publication date: May 13, 2004
    Applicant: Infineon Technologies North America Corp.
    Inventors: Xiaochun Linda Chen, Lawrence Varnerin, Bernhard Liegl