Abstract: Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at least one edge. In this example, the leadframe may further include a plurality of lead fingers having ends extending toward the at least one edge, wherein the ends of ones of adjacent lead fingers are staggered proximate and distal the at least one edge.

Abstract: Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at least one edge, the at least one edge having one or more slots located therein. In this example, the leadframe may further include a plurality of lead fingers having ends extending toward the at least one edge, wherein the ends of ones of pairs of adjacent lead fingers extend into corresponding slots in the paddle.

Abstract: An electronic device includes an integrated circuit (IC) package attached to a substrate and a heat sink attached to the IC package. Additionally, the electronic device also includes a film having an electric conductivity and contacting the heat sink and the IC package and extending to the substrate to provide a grounding connection for the heat sink. A method of manufacturing an electronic device includes connecting an IC package to a substrate, coupling a heat sink to the IC package and depositing a film having an electric conductivity and contacting the heat sink and the IC package and extending to the substrate to provide a grounding connection for the heat sink.

Abstract: A packaged integrated circuit for installation on a printed wiring board (PWB) or other type of circuit mounting structure, that allows for the routing of high-speed signals out from high-speed leads on an underside of the packaged integrated circuit. The packaged integrated circuit comprises a die and a package body formed from encapsulant that at least partially encloses the die. A leadframe is also connected to the die and partially enclosed in the package body. Leads extend out from the package body and a subset of these leads are separated by a lead-to-lead pitch. At least two adjacent leads of the leadframe are separated by a space larger than the pitch. An additional lead is also connected to the die and disposed on an underside of the package. The additional lead is connectable to a circuit mounting structure trace passing between the adjacent leads separated by the space larger than the pitch.

Abstract: A process for fabricating a power hybrid module including placing at least one carrier assembly in at least one opening in at least one printed circuit board, mounting the at least one carrier assembly and the at least one printed circuit board on assembly tape, electrically connecting one of the at least one carrier assemblies and one of the at least one printed circuit boards, overmolding the at least one carrier assembly and the at least one printed circuit board and removing the assembly tape to produce a surface mount power hybrid module. A power hybrid module including at least one printed circuit board with at least one opening therein, at least one carrier assembly, positioned in the at least one opening such that said at least one carrier assembly may be surface mounted and electrically connected to the at least one printed circuit board, and an overmold over the at least one printed circuit board and the at least one carrier assembly.