Patents by Inventor Lawson Guthrie

Lawson Guthrie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150205748
    Abstract: A telecommunications chassis includes an array of mezzanine card interfaces and a carrier module coupled to the mezzanine card interfaces to control and manage mezzanine cards connected to the mezzanine card interfaces.
    Type: Application
    Filed: December 15, 2014
    Publication date: July 23, 2015
    Applicant: Intel Corporation
    Inventors: Edoardo Campini, Steven Denies, Mark Summers, Lawson Guthrie
  • Patent number: 8913379
    Abstract: A telecommunications chassis includes an array of mezzanine card interfaces and a carrier module coupled to the mezzanine card interfaces to control and manage mezzanine cards connected to the mezzanine card interfaces.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: December 16, 2014
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, Steven Denies, Mark Summers, Lawson Guthrie
  • Publication number: 20130301208
    Abstract: Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
    Type: Application
    Filed: January 3, 2013
    Publication date: November 14, 2013
    Inventors: Edoardo Campini, Steven Denies, Mark Summers, Lawson Guthrie
  • Patent number: 8351198
    Abstract: Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: January 8, 2013
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, Steven DeNies, Mark Summers, Lawson Guthrie
  • Patent number: 7751333
    Abstract: Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: July 6, 2010
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, Steven DeNies, Mark Summers, Lawson Guthrie
  • Publication number: 20100110645
    Abstract: Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
    Type: Application
    Filed: October 14, 2009
    Publication date: May 6, 2010
    Inventors: Edoardo Campini, Steven DeNies, Mark Summers, Lawson Guthrie
  • Publication number: 20090038220
    Abstract: A planter insert extends the usefulness of a planter by creating a plurality of containers that fit within a planter. The containers may be supported by a planter platform suitably adapted to fit within the inside of the planter. The planter platform may suitably include an expansion member adapted to stabilize the planter platform. A suitably planter platform may also be modular enabling the planter platform to be disassembled and suitably stacked during storage or shipping.
    Type: Application
    Filed: October 1, 2008
    Publication date: February 12, 2009
    Inventor: Lawson Guthrie
  • Patent number: 7450796
    Abstract: An apparatus and system includes a radiation generation device for generating radiation and a radiation detection device. A first radiation channel is optically-coupled on a first end to the radiation generation device and configured to direct the radiation generated by the radiation generation device to a second end of the first radiation channel. A second radiation channel is optically-coupled on a first end to the radiation detection device and configured to direct radiation from a second end of the second radiation channel to the radiation detection device. An optical switch is configured to selectively interrupt the transmission of radiation from the second end of the first radiation channel to the second end of the second radiation channel.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: November 11, 2008
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, Steven DeNies, William Handley, Lawson Guthrie
  • Publication number: 20080141587
    Abstract: A planter insert extends the usefulness of a planter by creating a plurality of adjoined containers that fit within and conform to the inside shape of a planter, substantially filling its opening. The containers may be of uniform design and therefore portable and swappable, which facilitates modifying the arrangement of plants including those with different soil requirements and growing seasons. The containers may be adjoined using a locking system, a coupling system or any other means. A set of containers may be designed to fit around another object, such as an independent or center container of a different shape and size. Planter inserts provide maximum portability while minimizing wasted space often caused by gaps or support systems.
    Type: Application
    Filed: October 22, 2007
    Publication date: June 19, 2008
    Inventor: Lawson Guthrie
  • Patent number: 7336505
    Abstract: A method according to one embodiment may include providing circuit board having a faceplate. The method of this embodiment may also include providing a label surface capable of moving between a deployed position and a stowed position. When the label surface is in a deployed position at least a portion of the label surface extends outwardly from the faceplate relative to the circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: February 26, 2008
    Assignee: Intel Corporation
    Inventors: Edoardo Campini, Steven DeNies, William Handley, Lawson Guthrie
  • Patent number: 7266627
    Abstract: A method and apparatus to couple a rear transition module to a carrier board includes detecting a rear transition module (RTM) coupled to an interface resident on a carrier board, the carrier board coupled to a backplane. The method further includes logically coupling the RTM to a management controller resident on the carrier board and managing the RTM in a same manner as a front accessible module coupled to another interface resident on the carrier board.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: September 4, 2007
    Assignee: Intel Corporation
    Inventors: Steven DeNies, Mark Summers, Edoardo Campini, Lawson Guthrie
  • Patent number: 7248479
    Abstract: A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component through the first circuit board to a second side of the first circuit board. The method according to this embodiment may further include slidingly thermally coupling the second side of the first circuit board to a thermal solution disposed on a second circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: July 24, 2007
    Assignee: Intel Corporation
    Inventors: Mark D. Summers, Lawson Guthrie, William Handley
  • Publication number: 20060226239
    Abstract: An apparatus and system includes a radiation generation device for generating radiation and a radiation detection device. A first radiation channel is optically-coupled on a first end to the radiation generation device and configured to direct the radiation generated by the radiation generation device to a second end of the first radiation channel. A second radiation channel is optically-coupled on a first end to the radiation detection device and configured to direct radiation from a second end of the second radiation channel to the radiation detection device. An optical switch is configured to selectively interrupt the transmission of radiation from the second end of the first radiation channel to the second end of the second radiation channel.
    Type: Application
    Filed: March 30, 2005
    Publication date: October 12, 2006
    Inventors: Edoardo Campini, Steven DeNies, William Handley, Lawson Guthrie
  • Publication number: 20060221577
    Abstract: A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component through the first circuit board to a second side of the first circuit board. The method according to this embodiment may further include slidingly thermally coupling the second side of the first circuit board to a thermal solution disposed on a second circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Application
    Filed: March 29, 2005
    Publication date: October 5, 2006
    Inventors: Mark Summers, Lawson Guthrie, William Handley
  • Publication number: 20060221589
    Abstract: A method according to one embodiment may include providing circuit board having a faceplate. The method of this embodiment may also include providing a label surface capable of moving between a deployed position and a stowed position. When the label surface is in a deployed position at least a portion of the label surface extends outwardly from the faceplate relative to the circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Application
    Filed: March 29, 2005
    Publication date: October 5, 2006
    Inventors: Edoardo Campini, Steven DeNies, William Handley, Lawson Guthrie
  • Publication number: 20060218329
    Abstract: A method and apparatus to couple a rear transition module to a carrier board includes detecting a rear transition module (RTM) coupled to an interface resident on a carrier board, the carrier board coupled to a backplane. The method further includes logically coupling the RTM to a management controller resident on the carrier board and managing the RTM in a same manner as a front accessible module coupled to another interface resident on the carrier board.
    Type: Application
    Filed: March 23, 2005
    Publication date: September 28, 2006
    Inventors: Steven DeNies, Mark Summers, Edoardo Campini, Lawson Guthrie
  • Patent number: 7101188
    Abstract: High-reliability edge connector adaptor to support high bandwidth signal paths. The edge connector adapter includes an edge connector slot for mating with a card edge connector and a connector edge along which a set or sets of biased contacts are arrayed. The connector edge and biased contacts are configured to mate with a corresponding connector having an edge connector slot normally employed for coupling to a conventional card edge connector. In one embodiment, the edge connector slot in the adapter is configured to mate with the edge connector of an Advance Mezzanine Card (AdvancedMC) card, while the connector edge and biased contacts are configured to mate with an AdvancedMC connector. Upon assembly, the biased contacts are deflected so as to exert a normal force against a mating contact in the AdvancedMC connector. Meanwhile, the contacts of the AdvancedMC card are securely coupled to a mating contact in the edge connector adapter, e.g., using a solder or the like.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: September 5, 2006
    Assignee: Intel Corporation
    Inventors: Mark D. Summers, Lawson Guthrie, William Handley
  • Publication number: 20060140179
    Abstract: Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
    Type: Application
    Filed: December 29, 2004
    Publication date: June 29, 2006
    Inventors: Edoardo Campini, Steven DeNies, Mark Summers, Lawson Guthrie