Abstract: Two part cyanoacrylate/free radical curable adhesive systems are provided.

Abstract: Provided are flux-compatible epoxy-phenol adhesive compositions useful as a low gap underfill and novel phenols useful therein. The flux-compatible epoxy-phenol adhesive compositions include an epoxy component including an epoxy compound having a cycloaliphatic, alicyclic or mixed cycloaliphatic-aromatic backbone, a multifunctional phenolic component, and a catalyst. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.

Abstract: The disclosure relates to oxamate esters and formulations made therefrom, and to methods of making both the oxamate esters and the formulations.

Abstract: Provided are flux-compatible epoxy-anhydride compositions useful as low-gap underfill adhesives. The flux-compatible epoxy-anhydride compositions include an epoxy component and an anhydride composition comprising a monofunctional anhydride and at least one difunctional anhydride and optionally at least one polyfunctional anhydride. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.

Abstract: Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

Abstract: The present disclosure provides dual curable compositions having both radiation curing and shadow curing mechanisms. The compositions comprise silicon-organic hybrid polymers having rapid shadow curing by a 2 part isocyanate-polyol reaction and/or a 2 part cyclic carbonate-amine reaction. The compositions can be used as adhesives or coatings. The use of the compositions according to the disclosure is particularly preferred for use in electro-optical components especially for automobile display adhesives applications.

Abstract: Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Abstract: The present invention relates to curable novel resins and prepolymers, methods of manufacture and compositions made therefrom. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular, the inventive resins and prepolymers and compositions are useful in the assembly of LCD panels.

Abstract: The present invention relates to curable novel bismaleimide resins and prepolymers, methods of manufacture. Particularly useful applications include one drop fill sealant used in liquid crystal assembly. In particular, the inventive polymers and compositions are useful in the assembly of LCD panels.

Abstract: The present invention relates to bismaleimide resins and curable compositions for One Drop Fill sealant applications using such resins, particularly in liquid crystal display assembly applications. The inventive compositions can be cured by a UV, thermal or a combination of UV and thermal.

Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Abstract: The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.

Abstract: Silicone acrylic hybrid compositions prepared by reacting together silicone polymers, silicone resins, and silyl containing acrylic polymers are useful in adhesive compositions that find use in skin contact applications.

Abstract: A cationically polymerizable composition comprising (i) a cationically polymerizable resin, (ii) an onium salt, (iii) an azo or peroxide initiator, exhibits a lower cure temperature upon the addition of (iv) a catalytic or substoichiometric amount of an electron-rich vinyl resin to the reaction.

Abstract: Silicone acrylic hybrid compositions prepared by reacting together silicone polymers, silicone resins, and silyl containing acrylic polymers are useful in adhesive compositions that find use in skin contact applications.

Abstract: The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.

Abstract: A cationically polymerizable composition comprising (i) a cationically polymerizable resin, (ii) an onium salt, (iii) an azo or peroxide initiator, exhibits a lower cure temperature upon the addition of (iv) a catalytic or substoichiometric amount of an electron-rich vinyl resin to the reaction.