Patents by Inventor Lay Lim

Lay Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070001278
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Application
    Filed: June 19, 2006
    Publication date: January 4, 2007
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Gooi, Maria Cristina Estacio, David Chong, Tan Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Lim, Byoung-Ok Lee
  • Publication number: 20060105748
    Abstract: A portable data storage device has a non-volatile memory 3 for storing user data, an interface section 7 for receiving and transmitting data to a host, and a master control unit 1 for transferring data to and from the non-volatile memory 3. The portable data storage device further includes an integrated circuit 13 for generating a public/private key pair. The portable data storage device is arranged to transmit at least one of the keys out of the device. In different embodiments, the host can verify that the data it receives is correct, and the device can verify that the host has received the correct data.
    Type: Application
    Filed: April 26, 2004
    Publication date: May 18, 2006
    Inventors: Chin Shyan Ooi, Lay Lim, Teng Pin Poo, Henry Tan
  • Publication number: 20050081064
    Abstract: An authentication system (10) to verify a password is provided. The authentication system includes a first storage unit (16) to store an authentication sequence (24) and a read-only memory unit (18) on which an authentication algorithm (26) is programmed. A microcontroller (20) is coupled to the first storage unit, the read-only memory unit and a web server. The microcontroller receives the password and executes the authentication algorithm to verify the password with the authentication sequence. A second storage unit (22) is coupled to the microcontroller to store data from the web server. Access to a second storage unit is permitted by the microcontroller only if the password has been verified.
    Type: Application
    Filed: October 4, 2002
    Publication date: April 14, 2005
    Inventors: Chin Ooi, Lay Lim, Teng Poo, Henry Tan
  • Publication number: 20050036521
    Abstract: Program clock references in first and second MPEG data streams are re-stamped in accordance with delays introduced into the first and second MPEG data streams. Accordingly, the program clock references in the first MPEG data stream are re-stamped according to a variable delay in the first MPEG data stream, and the program clock references in the second MPEG data stream are re-stamped according to a variable delay in the second MPEG data stream. The re-stamped program clock references in the second MPEG data stream are corrected according to a fixed delay in the second MPEG data stream. The first and second MPEG data streams are multiplexed, and the multiplexed first and second MPEG data streams are transmitted and received.
    Type: Application
    Filed: August 14, 2003
    Publication date: February 17, 2005
    Inventors: Jin Kim, Timothy Laud, Lay Lim
  • Patent number: 5862146
    Abstract: A process and apparatus for testing wide word memory parts (618-624), sixteen data I/O leads per part, uses two stages of relays (610, 612 and 614) to connect the memory parts to sixteen test receivers (Ra, Rb, Rc and Rd). When the memory parts are in a normal operating mode or non-DFT mode, the relays connect all sixteen data I/O leads of each memory part to the sixteen test receivers, one memory part at a time. When the memory parts are in the DFT mode, the relays connect all the active DFT data I/O leads (0-3) to the receivers. A test performance board can carry one or more modules of memory parts with each module containing plural sockets for retaining the memory parts and one or more stages of relays.
    Type: Grant
    Filed: April 15, 1997
    Date of Patent: January 19, 1999
    Assignee: Texas Instruments Incorporated
    Inventors: Teck Liong Chen, Choon Poh Looi, Fock San Ho, Kok Lay Lim