Patents by Inventor Lay Siong Goh

Lay Siong Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9494562
    Abstract: Methods and apparatus for non-destructive testing of a composite structure utilizing sonic or ultrasonic waves. In response to a wideband chirp wave sonic excitation signal transmitted from a probe to the composite structure, a probe signal received is correlated with a library of predetermined probe signals and a graphical representation of defects detected is generated. The graphical representation provides detailed information on defect type, defect location and defect shape.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: November 15, 2016
    Assignee: Agency for Science, Technology and Research
    Inventors: Wei Lin, Lay Siong Goh, Lye Seng Wong, Heng Kiat Jonathan Hey, Ricky Riyadi Chan, Roman Britner
  • Publication number: 20130338941
    Abstract: Methods and apparatus for non-destructive testing of a composite structure utilizing sonic or ultrasonic waves. In response to a wideband chirp wave sonic excitation signal transmitted from a probe to the composite structure, a probe signal received is correlated with a library of predetermined probe signals and a graphical representation of defects detected is generated. The graphical representation provides detailed information on defect type, defect location and defect shape.
    Type: Application
    Filed: May 27, 2011
    Publication date: December 19, 2013
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Wei Lin, Lay Siong Goh, Lye Seng Wong, Heng Kiat Jonathan Hey, Ricky Riyadi Chan, Roman Britner