Abstract: The present disclosure relates to an optical sensing module, a system and a method for operating the optical sensing system. The optical sensing module includes a light emitter that emits a sensing light in a specific wavelength range and a photodiode unit. The photodiode unit includes a first photodiode used to sense a first wavelength light, a second photodiode used to sense a second wavelength light, and a third photodiode used to sense a third wavelength light. The optical sensing module implements a proximity sensor by operations of the second photodiode and the third photodiode, or a biometric sensor by operations of the first photodiode, the second photodiode, and the third photodiode. The photodiode unit receives a reflected light from an object to be detected so as to determine if the object is proximal, and then determine whether or not the proximal object is human skin.

Abstract: The present disclosure relates to an optical sensing module, a system and a method for operating the optical sensing system. The optical sensing module includes a light emitter that emits a sensing light in a specific wavelength range and a photodiode unit. The photodiode unit includes a first photodiode used to sense a first wavelength light, a second photodiode used to sense a second wavelength light, and a third photodiode used to sense a third wavelength light. The optical sensing module implements a proximity sensor by operations of the second photodiode and the third photodiode, or a biometric sensor by operations of the first photodiode, the second photodiode, and the third photodiode. The photodiode unit receives a reflected light from an object to be detected so as to determine if the object is proximal, and then determine whether or not the proximal object is human skin.

Abstract: An infrared proximity sensor includes a substrate, an emitting unit, a receiving unit, a packaging unit and an isolating unit. The substrate has a supporting surface and the supporting surface has an emitting region and a receiving region corresponding in position to the emitting region. The emitting unit is disposed on the emitting region. The receiving unit is disposed on the receiving region. The packaging unit includes a first package body and a second package body. The first package body covers the emitting unit and the second package body covers the receiving unit. The isolating unit is disposed between the first package body and the second package body. The substrate has a first side and a second side, and the first side has a length less than 1.5 mm.