Abstract: Method and apparatus for clocked data eye measurement at synchronous interfaces is provided. A receiver may generate first vector information corresponding to data received on at least one communication channel at the receiver. The receiver may generate second information regarding when the data was latched by a clock signal, the clock signal being received on a separate communication channel at the receiver. The first vector information may be combined with the second information to generate combined information, the combined information indicating a quality of latching the data.

Abstract: Embodiments herein discuss tuning a testing apparatus to better match the input response of a target system in which a cable will be used. For example, conductors in the cable may have a different skew depending on the system in which they are used. The testing apparatus may be tuned using frequency information regarding the type of signals that will be driven on the cable when installed in the target system. In one embodiment, the testing apparatus uses the frequency information to configure a programmable clock source that can be used to shape a reference clock and control a driver to match the signals in the target system. Using the clock source to modify the reference clock results in the driver outputting a testing signal that better reflects the actual signals that will be transmitted on the cable in the target system.

Abstract: Embodiments herein discuss tuning a testing apparatus to better match the input response of a target system in which a cable will be used. For example, conductors in the cable may have a different skew depending on the system in which they are used. The testing apparatus may be tuned using frequency information regarding the type of signals that will be driven on the cable when installed in the target system. In one embodiment, the testing apparatus adjusts a testing cycle refresh rate for generating a testing signal which changes the frequency content of the testing signal. Using the adjusted testing cycle refresh rate results in the driver outputting a testing signal that better reflects the actual signals that will be transmitted on the cable in the target system.

Abstract: The embodiments of the present disclosure identify a target chip from among multiple chips coupled to a shared bus and customize an optimization parameter for the particular chip. Stated differently, in a communication system where only one chip (or a subset of chips) on a shared bus is the intended target, the system can customize an optimization parameter for the specific location of the target chip on the bus. As new data is received that is intended for a different chip—i.e., the target chip changes—the system can dynamically change the parameter based on the location of the new target chip on the bus.

Abstract: The embodiments of the present disclosure identify a target chip from among multiple chips coupled to a shared bus and customize an optimization parameter for the particular chip. Stated differently, in a communication system where only one chip (or a subset of chips) on a shared bus is the intended target, the system can customize an optimization parameter for the specific location of the target chip on the bus. As new data is received that is intended for a different chip—i.e., the target chip changes—the system can dynamically change the parameter based on the location of the new target chip on the bus.

Abstract: The embodiments of the present disclosure identify a target chip from among multiple chips coupled to a shared bus and customize an optimization parameter for the particular chip. Stated differently, in a communication system where only one chip (or a subset of chips) on a shared bus is the intended target, the system can customize an optimization parameter for the specific location of the target chip on the bus. As new data is received that is intended for a different chip—i.e., the target chip changes—the system can dynamically change the parameter based on the location of the new target chip on the bus.

Abstract: The embodiments of the present disclosure identify a target chip from among multiple chips coupled to a shared bus and customize an optimization parameter for the particular chip. Stated differently, in a communication system where only one chip (or a subset of chips) on a shared bus is the intended target, the system can customize an optimization parameter for the specific location of the target chip on the bus. As new data is received that is intended for a different chip—i.e., the target chip changes—the system can dynamically change the parameter based on the location of the new target chip on the bus.

Abstract: The embodiments of the present disclosure identify a target chip from among multiple chips coupled to a shared bus and customize an optimization parameter for the particular chip. Stated differently, in a communication system where only one chip (or a subset of chips) on a shared bus is the intended target, the system can customize an optimization parameter for the specific location of the target chip on the bus. As new data is received that is intended for a different chip—i.e., the target chip changes—the system can dynamically change the parameter based on the location of the new target chip on the bus.

Abstract: The embodiments of the present disclosure identify a target chip from among multiple chips coupled to a shared bus and customize an optimization parameter for the particular chip. Stated differently, in a communication system where only one chip (or a subset of chips) on a shared bus is the intended target, the system can customize an optimization parameter for the specific location of the target chip on the bus. As new data is received that is intended for a different chip—i.e., the target chip changes—the system can dynamically change the parameter based on the location of the new target chip on the bus.

Abstract: An access control system removes the human element from static protection by detecting a level of static energy when the user attempts to authenticate to the access control system, and when the user's detected level of static energy exceeds a defined threshold, access is denied until the user discharges the static energy. A static energy detection mechanism in a badge reader includes two conductive plates that form a first capacitor, and the space between an electrically conductive badge and one of the conductive plates on the badge reader forms a second capacitor. Using these two capacitors, the level of static energy on the user can be measured by the sum of the voltage across these two capacitors as the user presents the badge to the badge reader. The access control system assures the user is properly grounded before allowing access to an area, equipment, etc.

Abstract: A system and method for managing device communication anonymously in wireless networks. A controller in a device manages communication for the device. The device has a static device tag. The controller establishes a first key for the device. The controller establishes the first key in response to a first triggering event of the device. The first key is based on a first status of the device. The controller generates a first identifier of the device. The controller generates the first identifier by using a hashing technique. The controller uses the hashing technique on a combination of the first key and the static device tag. The first identifier is for identifying the device on a first wireless network. The controller provides a second status of the device. The controller provides the second status to the first wireless network. The controller couples the second status with the first identifier.

Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.