Patents by Inventor Lay Wai Kong

Lay Wai Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPUTATIONAL DATA STORAGE SYSTEMS
    Publication number: 20220188028
    Abstract: In one embodiment, a system comprises a host processor and a storage system. The storage system comprises one or more storage devices, and each storage device comprises a non-volatile memory and a compute offload controller. The non-volatile memory stores data, and the compute offload controller performs compute tasks on the data based on compute offload commands from the host processor.
    Type: Application
    Filed: March 12, 2020
    Publication date: June 16, 2022
    Applicant: Intel Corporation
    Inventors: Michael P. Mesnier, John S. Keys, Ian F. Adams, Yi Zou, Luis Carlos Maria Remis, Daniel Robert McLeran, Mariusz Barczak, Arun Raghunath, Lay Wai Kong
  • Methods of forming sensor integrated packages and structures formed thereby
    Patent number: 9505607
    Abstract: Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: November 29, 2016
    Assignee: Intel Corporation
    Inventors: Kyu Oh Lee, Zheng Zhou, Islam A. Salama, Feras Eid, Sasha N. Oster, Lay Wai Kong, Javier Soto Gonzalez
  • METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY
    Publication number: 20160280535
    Abstract: Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.
    Type: Application
    Filed: March 27, 2015
    Publication date: September 29, 2016
    Applicant: Intel Corporation
    Inventors: Kyu Oh Lee, Zheng Zhou, Islam A. Salama, Feras Eid, Sasha N. Oster, Lay Wai Kong, Javier Soto Gonzalez