Abstract: Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.

Abstract: A solid state drive (SSD) device includes a cage with a top wall and a bottom wall spaced a distance from the top wall so as to define a cage interior between the top and bottom walls. In addition, at least 10% of an area along a side of the cage is open to the cage interior to permit airflow through the side of the cage. At least one printed circuit board (PCB), which includes at least one integrated circuit component, is also provided within the cage interior.

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

Abstract: A solid state drive (SSD) device includes a cage with a top wall and a bottom wall spaced a distance from the top wall so as to define a cage interior between the top and bottom walls. In addition, at least 10% of an area along a side of the cage is open to the cage interior to permit airflow through the side of the cage. At least one printed circuit board (PCB), which includes at least one integrated circuit component, is also provided within the cage interior.

Abstract: In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.

Abstract: A scalable multiprocessor computing system includes first and second computing devices and a link module connecting the computing devices. The link module includes a guide connector that aligns and couples the first computing device with the second computing device in an orientation in which a printed circuit board assembly (PCBA) support housing wall of the first computing device faces a PCBA support housing wall of the second computing device, a bracket member that is connected along corresponding lengthwise sides of the first and second computing devices, and a cable connector that provides a signal connection between the processor of the first computing device and the processor of the second computing device. The guide connector is connected to the bracket member.

Abstract: The embodiments herein describe a function module that is removably mounted in a chassis. For example, the chassis may be a server chassis which stores a plurality of blade servers which uses hardware components and a fan module mounted in the function module to increase the storage capacity or computing performance of the blade servers. The function module can include PCIe cards, GPU cards, hard drives, and the like which are communicatively coupled to the blade servers in the chassis. In one embodiment, the function module is slidably mounted onto the chassis so that when pulled by the system administrator, the function module slides out of a front or rear side of the chassis. Doing so provides room for the system administrator to then add and/or remove the hardware components and the fan module mounted in the function module.

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

Abstract: The embodiments herein describe a computing device (e.g., a storage server) that includes at least one telescoping unit which includes a plurality of removable (or pluggable) hardware components. The computing device includes a chassis which defines a form factor of the computing device. The telescoping unit, when prompted by the user, can extend vertically from a top surface of the computing device. By doing so, the pluggable hardware components are then exposed to the user who can add or replace the components. In one embodiment, the telescoping unit includes telescoping links disposed on opposite sides which are used to guide or urge the telescoping unit vertically from the chassis. Cross links may be coupled between first and second rails where one end of each of the links is coupled to a sliding member in the rail while the other end is fixably attached to the rail.

Abstract: Disclosed herein are system, method, and computer program product embodiments system of migration and validation. An embodiment operates by receiving an indication of a plurality of documents for migration from a legacy data format to a new data format of a computing system. A first set of data statistics corresponding to a selected one of the subset of documents prior to a performance of the migration, and a second set of data statistics corresponding to the selected document after the performance of the migration are determined. Both the first set of data statistics and the second set of data statistics side-by-side for the selected document are displayed. An indication whether the migration is validated or invalidated is received.

Abstract: In one embodiment a disk array enclosure includes: a two rack (2RU) enclosure configured with a multiplicity of rows of backplane slots on an inner bottom panel of the 2RU enclosure, a multiplicity of 2.5 inch disks mounted lengthwise in parallel to the inner bottom panel, and a multiplicity of paddle cards, each connected to one of the 2.5 inch disks and slotted into one of the backplane slots.

Abstract: The present invention discloses a method for converting biomass material into soluble substances by one-step, comprising: converting biomass materials into soluble substances by one-step by electrolyzing at a certain time under the condition of constant current using bipolar three-dimension-electrodes system, wherein bipolar three-dimension-electrodes system including an anode, a cathode, particle electrodes and electrolyte, and in electrolyzing process, the particle electrodes and the biomass materials being suspended in the electrolyte.