Patents by Inventor Le Luo
Le Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12108308Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may identify a multicast service available for subscription by the UE or to which the UE is already subscribed. The UE may transmit a message, to a network node, that may include UE assistance information (UAI) indicating at least one of a UE capability to process multicast transmissions or a feedback scheme preference for reporting feedback for the multicast transmissions. The UAI may also include at least one of a multicast carrier preference, band or carrier measurement report, a multicast priority indication, or a measurement and reporting scheme preference for the multicast transmissions. The network node may receive the UAI and determine one or more parameters for multicast communications with the UE based on the UAI. The UE may receive the multicast transmissions from the network node in accordance with the UAI.Type: GrantFiled: June 8, 2021Date of Patent: October 1, 2024Assignee: QUALCOMM IncorporatedInventors: Le Liu, Alberto Rico Alvarino, Prasad Reddy Kadiri, Umesh Phuyal, Bharat Shrestha, Juan Montojo, Peter Gaal, Wanshi Chen, Kazuki Takeda, Ayan Sengupta, Tao Luo, Xiaoxia Zhang
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Patent number: 12092592Abstract: The present invention discloses a device and method for measuring the relative permeability of propped fractures in shale considering probability distribution, comprising a gas cylinder, a water pump, a booster pump, a rock slab holder, a differential pressure sensor, a directional X-ray source, an X-ray detector, an X-ray shielding box, a tee, a liquid meter, a gas meter, an electronic balance, and a vacuum pump; the inlet of rock slab holder is respectively connected with the gas cylinder and the water pump by the pipe, the outlet is connected with the liquid meter and the vacuum pump by the tee, and the differential pressure sensor is connected with both ends of the rock slab holder; the booster pump is connected with the rock slab holder by the pipe; the inlet of the gas meter is connected with the liquid meter, and the outlet is connected to the external atmosphere.Type: GrantFiled: December 30, 2022Date of Patent: September 17, 2024Assignee: Southwest Petroleum UniversityInventors: Zhenglan Li, Yonggang Duan, Mingqiang Wei, Quantang Fang, Le Luo, Keyi Ren, Lei Meng, Shuxin Li, Zhihong Nie
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Patent number: 12074708Abstract: Methods, systems, and devices for wireless communication are described. Generally, the described techniques provide for efficiently facilitating acknowledgment (ACK) or negative acknowledgment (NACK) feedback from a user equipment (UE) for a set of transport blocks in one or more multicast transmissions from a base station. The UE may determine control channel resources for transmitting the ACK/NACK feedback, and each respective control channel resource may correspond to a distinct subset of the set of transport blocks. Once the UE determines a subset of transport blocks that the UE failed to decode (such as at least one transport block), the UE may determine a respective control channel resource that corresponds to the at least one transport block that the UE failed to decode. The UE may transmit ACK/NACK feedback on the respective control channel resource, which, in some examples, may indicate that the UE failed to decode the subset of transport blocks.Type: GrantFiled: June 8, 2021Date of Patent: August 27, 2024Assignee: QUALCOMM IncorporatedInventors: Ayan Sengupta, Alberto Rico Alvarino, Le Liu, Kazuki Takeda, Peter Gaal, Tao Luo, Wanshi Chen, Xiaoxia Zhang, Juan Montojo, Umesh Phuyal, Prasad Reddy Kadiri
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Patent number: 12069750Abstract: Methods, systems, and devices for wireless communications are described. A relay node may establish a control plane connection between the relay node and a base station, wherein establishing the control plane connection comprises receiving from the base station a first network identifier for the relay node. The relay node may receive, via the control plane connection, a relay configuration from the base station. The relay node may monitor grants associated with a set of one or more user equipment (UEs) based at least in part on the relay configuration, each UE comprising a network identifier that is different from the first network identifier. The relay node may relay communications between the base station and the set of one or more UEs according to the monitoring.Type: GrantFiled: June 1, 2020Date of Patent: August 20, 2024Assignee: QUALCOMM IncorporatedInventors: Alberto Rico Alvarino, Le Liu, Wanshi Chen, Tao Luo, Juan Montojo
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Patent number: 12058901Abstract: A display device and a vehicle are disclosed. The display device has a display area including a plurality of display sub areas and a plurality of transparent sub areas. The display device includes a display panel and an electrochromic layer disposed on one side of the display panel. The electrochromic layer includes at least one electrochromic device, the at least one electrochromic device corresponds to at least one of the transparent sub areas, and the at least one electrochromic device transitions between transparent and opaque states.Type: GrantFiled: July 27, 2022Date of Patent: August 6, 2024Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.Inventors: Haiyan Shen, Zhimeng Luo, Le Zhang, Wenxu Xianyu, Chunpeng Zhang
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Patent number: 12047974Abstract: Aspects described herein relate to indicating downlink control information (DCI) for multicast and/or broadcast (MB) communications using DCI formats that may be based on existing DCI formats and/or size for unicast communications, paging signals, system information signals, etc., or may include shortened formats without fields for information that may not be used in MB communications.Type: GrantFiled: April 24, 2023Date of Patent: July 23, 2024Assignee: QUALCOMM IncorporatedInventors: Le Liu, Alberto Rico Alvarino, Peter Gaal, Xiaoxia Zhang, Tao Luo, Prasad Reddy Kadiri, Ayan Sengupta, Kazuki Takeda, Umesh Phuyal
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Patent number: 12041637Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE or a component thereof configured to receive, from a base station, SPS configuration information for broadcast and/or multicast indicating a set of resources configured for feedback, with each transmit (TX) beam of a set of TX beams corresponding to a respective subset of the set of resources. The apparatus may be further configured to receive SPS signaling from the base station via one or more TX beams of the set of TX beams over each of a set of SPS occasions. The apparatus may be further configured to transmit feedback to the base station on one or more subsets of the set of resources respectively corresponding to the one or more TX beams based on the SPS signaling, the feedback indicating one of acknowledgement (ACK) or non-acknowledgement (NACK).Type: GrantFiled: February 23, 2021Date of Patent: July 16, 2024Assignee: QUALCOMM IncorporatedInventors: Le Liu, Kazuki Takeda, Wanshi Chen, Alberto Rico Alvarino, Peter Gaal, Tao Luo, Juan Montojo
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Publication number: 20240159692Abstract: The present invention discloses a device and method for measuring the relative permeability of propped fractures in shale considering probability distribution, comprising a gas cylinder, a water pump, a booster pump, a rock slab holder, a differential pressure sensor, a directional X-ray source, an X-ray detector, an X-ray shielding box, a tee, a liquid meter, a gas meter, an electronic balance, and a vacuum pump; the inlet of rock slab holder is respectively connected with the gas cylinder and the water pump by the pipe, the outlet is connected with the liquid meter and the vacuum pump by the tee, and the differential pressure sensor is connected with both ends of the rock slab holder; the booster pump is connected with the rock slab holder by the pipe; the inlet of the gas meter is connected with the liquid meter, and the outlet is connected to the external atmosphere.Type: ApplicationFiled: December 30, 2022Publication date: May 16, 2024Applicant: Southwest Petroleum UniversityInventors: Zhenglan LI, Yonggang DUAN, Mingqiang WEI, Quantang FANG, Le LUO, Keyi REN, Lei MENG, Shuxin LI, Zhihong NIE
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Patent number: 11701870Abstract: Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.Type: GrantFiled: December 21, 2015Date of Patent: July 18, 2023Inventors: Xiaosu Yi, Yan Tan, Jianfeng Tong, Qinghua Liao, Xu Chen, Feng Shi, Hu Zhang, Le Luo, Ziqing Liang, Nengwen Liu, Lingsheng Zhong
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Patent number: 11513051Abstract: The present invention discloses a shale stress sensitivity testing device and method. The testing device comprises a support table. The left and right ends of the upper surface of the support table are respectively provided with a left side plate and a right side plate. The top of the left and right side plates are connected with the left and right ends of the top plate. The chucks of the clamps are capable of reciprocating motion in the horizontal direction and circular motion in the front-rear direction. The present invention can change the intensity and direction of the effective stress of the rock sample, and determine the permeability of the rock sample under different effective stresses, thus enabling comprehensive testing of the stress sensitivity of shale in different directions and enhancing the accuracy of shale stress sensitivity testing.Type: GrantFiled: June 30, 2022Date of Patent: November 29, 2022Assignee: Southwest Petroleum UniversityInventors: Mingqiang Wei, Yonggang Duan, Quantang Fang, Zhenglan Li, Le Luo, Keyi Ren, Xin Wang, Shuxin Li, Zhihong Nie
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Publication number: 20190001640Abstract: Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.Type: ApplicationFiled: December 21, 2015Publication date: January 3, 2019Inventors: Xiaosu Yi, Yan Tan, Jianfeng Tong, Qinghua Liao, Xu Chen, Feng Shi, Hu Zhang, Le Luo, Ziqing Liang, Nengwen Liu, Lingsheng Zhong
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Patent number: 10163845Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.Type: GrantFiled: July 1, 2014Date of Patent: December 25, 2018Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Keng Yew Song, Yi Bin Wang, Zuo Cheng Shen, Jia Le Luo, Qing Le Tan
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Patent number: 9889521Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.Type: GrantFiled: December 2, 2014Date of Patent: February 13, 2018Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Keng Yew Song, Yi Bin Wang, Qing Le Tan, Lin Wei Zheng, Jia Le Luo
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Publication number: 20160153880Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.Type: ApplicationFiled: December 2, 2014Publication date: June 2, 2016Inventors: Keng Yew SONG, Yi Bin WANG, Qing Le TAN, Lin Wei ZHENG, Jia Le LUO
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Publication number: 20150008251Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.Type: ApplicationFiled: July 1, 2014Publication date: January 8, 2015Inventors: Keng Yew SONG, Yi Bin WANG, Zuo Cheng SHEN, Jia Le LUO, Qing Le TAN
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Patent number: 8900986Abstract: A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.Type: GrantFiled: October 21, 2011Date of Patent: December 2, 2014Assignee: Shanghai Institute of Microsystem and Information Technology, Chinese Academy of SciencesInventors: Qiuping Huang, Le Luo, Gaowei Xu, Yuan Yuan
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Publication number: 20140297763Abstract: A method of managing networked devices for a control point in a network system is provided. The method includes listening to a discovery message transmitted from a networked device, wherein the discovery message indicates groups corresponding to the networked device, selecting at least one networked device according to a group, and transmitting a message to the at least one networked device for instructing the at least one networked device to execute or provide its service.Type: ApplicationFiled: June 26, 2013Publication date: October 2, 2014Inventors: JinGuang Wan, Xing Wang, Le Luo, Chia-Chieh Liu
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Publication number: 20130273730Abstract: A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.Type: ApplicationFiled: October 21, 2011Publication date: October 17, 2013Inventors: Qiuping Huang, Le Luo, Gaowei Xu, Yuan Yuan