Patents by Inventor Le Luo
Le Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11991598Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) and a base station may communicate in a wireless communications system. The UE may receive first control signaling indicating a first radio network temporary identifier (RNTI) and a first feedback process identifier, where the first RNTI indicates scheduling of a unicast downlink transmission. The UE may also receive second control signaling indicating a second RNTI and a second feedback process identifier, where the second RNTI indicates scheduling of a multicast downlink transmission. The UE may manage a hybrid automatic repeat request (HARM) process at the UE associated with the unicast downlink transmission and the multicast downlink transmission based on the first RNTI, the first feedback process identifier, the second RNTI, and the second feedback process identifier. The UE may also simultaneously process multicast downlink transmission and broadcast signaling.Type: GrantFiled: April 29, 2021Date of Patent: May 21, 2024Assignee: QUALCOMM IncorporatedInventors: Kazuki Takeda, Alberto Rico Alvarino, Le Liu, Peter Gaal, Wanshi Chen, Ayan Sengupta, Prasad Reddy Kadiri, Tao Luo, Mostafa Khoshnevisan, Juan Montojo, Umesh Phuyal, Wooseok Nam
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Publication number: 20240159692Abstract: The present invention discloses a device and method for measuring the relative permeability of propped fractures in shale considering probability distribution, comprising a gas cylinder, a water pump, a booster pump, a rock slab holder, a differential pressure sensor, a directional X-ray source, an X-ray detector, an X-ray shielding box, a tee, a liquid meter, a gas meter, an electronic balance, and a vacuum pump; the inlet of rock slab holder is respectively connected with the gas cylinder and the water pump by the pipe, the outlet is connected with the liquid meter and the vacuum pump by the tee, and the differential pressure sensor is connected with both ends of the rock slab holder; the booster pump is connected with the rock slab holder by the pipe; the inlet of the gas meter is connected with the liquid meter, and the outlet is connected to the external atmosphere.Type: ApplicationFiled: December 30, 2022Publication date: May 16, 2024Applicant: Southwest Petroleum UniversityInventors: Zhenglan LI, Yonggang DUAN, Mingqiang WEI, Quantang FANG, Le LUO, Keyi REN, Lei MENG, Shuxin LI, Zhihong NIE
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Publication number: 20240146465Abstract: A method for wireless communication performed by a user equipment (UE) includes receiving, from a base station, a first indication to disable hybrid automatic repeat request (HARQ) feedback for a number of instances of a multicast transport block (TB). The method also includes receiving, from the base station, a second indication identifying a value of the number of instances of the multicast TB. The method further includes receiving, from the base station, one or more instances of the multicast TB. The method still further includes determining, based on the one or more received instances, whether the multicast TB is recoverable. The method further includes selectively transmitting, to the base station, HARQ feedback after all instances of the multicast TB have been transmitted by the base station based on the determination of whether the multicast TB is recoverable.Type: ApplicationFiled: June 30, 2023Publication date: May 2, 2024Inventors: Le LIU, Alberto RICO ALVARINO, Kazuki TAKEDA, Wanshi CHEN, Tao LUO, Ayan SENGUPTA, Xiaoxia ZHANG, Peter GAAL
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Patent number: 11968626Abstract: Methods, systems, and devices for wireless communications are described. A method for wireless communication at a user equipment (UE) may include: receiving a multicast bandwidth part configuration for multicast communications between a base station and the UE, where the multicast bandwidth part configuration includes a maximum number of multiple-input, multiple-output layers to be used for the multicast communications; establishing a multicast link with the base station for multicast communications; determining to use a reduced number of antennas for multicast reception than the number of antennas used for unicast reception, or determining that the UE is able to decode the multicast communications prior to a remaining portion of the multicast communications; and receiving the multicast communications via the reduced number of antennas, or reducing the radio frequency power prior to completion of a number of repetitions or retransmissions of the multicast communications.Type: GrantFiled: December 15, 2022Date of Patent: April 23, 2024Assignee: QUALCOMM IncorporatedInventors: Xiaoxia Zhang, Jing Sun, Le Liu, Alberto Rico Alvarino, Peter Gaal, Tao Luo
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Publication number: 20240089997Abstract: Methods, systems, and devices for wireless communications are described. Generally, a user equipment (UE) may support both unicast and multicast downlink signaling, such as on a single component carrier (CC). A UE may receive a unicast message over a first CC during a transmission time interval (TTI) using a first set of processing resources. The UE may simultaneously receive a multicast message over the first CC during the same TTI using a second set of processing resources. The first and second sets of processing resources may be associated with first and second hybrid automatic repeat request (HARM) soft buffers, first and second CCs, or first and second transmit/receive points (TRPs).Type: ApplicationFiled: September 15, 2023Publication date: March 14, 2024Inventors: Kazuki TAKEDA, Alberto RICO ALVARINO, Le LIU, Peter GAAL, Wanshi CHEN, Ayan SENGUPTA, Prasad Reddy KADIRI, Tao LUO, Mostafa KHOSHNEVISAN, Juan MONTOJO, Umesh PHUYAL, Wooseok NAM
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Patent number: 11924766Abstract: Methods, systems, and devices for wireless communications are described. A method for wireless communication at a user equipment (UE) may include: receiving a multicast bandwidth part configuration for multicast communications between a base station and the UE, where the multicast bandwidth part configuration includes a maximum number of multiple-input, multiple-output layers to be used for the multicast communications; establishing a multicast link with the base station for multicast communications; determining to use a reduced number of antennas for multicast reception than the number of antennas used for unicast reception, or determining that the UE is able to decode the multicast communications prior to a remaining portion of the multicast communications; and receiving the multicast communications via the reduced number of antennas, or reducing the radio frequency power prior to completion of a number of repetitions or retransmissions of the multicast communications.Type: GrantFiled: December 15, 2022Date of Patent: March 5, 2024Assignee: QUALCOMM IncorporatedInventors: Xiaoxia Zhang, Jing Sun, Le Liu, Alberto Rico Alvarino, Peter Gaal, Tao Luo
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Patent number: 11701870Abstract: Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.Type: GrantFiled: December 21, 2015Date of Patent: July 18, 2023Inventors: Xiaosu Yi, Yan Tan, Jianfeng Tong, Qinghua Liao, Xu Chen, Feng Shi, Hu Zhang, Le Luo, Ziqing Liang, Nengwen Liu, Lingsheng Zhong
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Patent number: 11513051Abstract: The present invention discloses a shale stress sensitivity testing device and method. The testing device comprises a support table. The left and right ends of the upper surface of the support table are respectively provided with a left side plate and a right side plate. The top of the left and right side plates are connected with the left and right ends of the top plate. The chucks of the clamps are capable of reciprocating motion in the horizontal direction and circular motion in the front-rear direction. The present invention can change the intensity and direction of the effective stress of the rock sample, and determine the permeability of the rock sample under different effective stresses, thus enabling comprehensive testing of the stress sensitivity of shale in different directions and enhancing the accuracy of shale stress sensitivity testing.Type: GrantFiled: June 30, 2022Date of Patent: November 29, 2022Assignee: Southwest Petroleum UniversityInventors: Mingqiang Wei, Yonggang Duan, Quantang Fang, Zhenglan Li, Le Luo, Keyi Ren, Xin Wang, Shuxin Li, Zhihong Nie
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Publication number: 20190001640Abstract: Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.Type: ApplicationFiled: December 21, 2015Publication date: January 3, 2019Inventors: Xiaosu Yi, Yan Tan, Jianfeng Tong, Qinghua Liao, Xu Chen, Feng Shi, Hu Zhang, Le Luo, Ziqing Liang, Nengwen Liu, Lingsheng Zhong
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Patent number: 10163845Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.Type: GrantFiled: July 1, 2014Date of Patent: December 25, 2018Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Keng Yew Song, Yi Bin Wang, Zuo Cheng Shen, Jia Le Luo, Qing Le Tan
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Patent number: 9889521Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.Type: GrantFiled: December 2, 2014Date of Patent: February 13, 2018Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Keng Yew Song, Yi Bin Wang, Qing Le Tan, Lin Wei Zheng, Jia Le Luo
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Publication number: 20160153880Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.Type: ApplicationFiled: December 2, 2014Publication date: June 2, 2016Inventors: Keng Yew SONG, Yi Bin WANG, Qing Le TAN, Lin Wei ZHENG, Jia Le LUO
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Publication number: 20150008251Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.Type: ApplicationFiled: July 1, 2014Publication date: January 8, 2015Inventors: Keng Yew SONG, Yi Bin WANG, Zuo Cheng SHEN, Jia Le LUO, Qing Le TAN
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Patent number: 8900986Abstract: A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.Type: GrantFiled: October 21, 2011Date of Patent: December 2, 2014Assignee: Shanghai Institute of Microsystem and Information Technology, Chinese Academy of SciencesInventors: Qiuping Huang, Le Luo, Gaowei Xu, Yuan Yuan
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Publication number: 20140297763Abstract: A method of managing networked devices for a control point in a network system is provided. The method includes listening to a discovery message transmitted from a networked device, wherein the discovery message indicates groups corresponding to the networked device, selecting at least one networked device according to a group, and transmitting a message to the at least one networked device for instructing the at least one networked device to execute or provide its service.Type: ApplicationFiled: June 26, 2013Publication date: October 2, 2014Inventors: JinGuang Wan, Xing Wang, Le Luo, Chia-Chieh Liu
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Publication number: 20130273730Abstract: A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.Type: ApplicationFiled: October 21, 2011Publication date: October 17, 2013Inventors: Qiuping Huang, Le Luo, Gaowei Xu, Yuan Yuan