Patents by Inventor Le Luo

Le Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240159692
    Abstract: The present invention discloses a device and method for measuring the relative permeability of propped fractures in shale considering probability distribution, comprising a gas cylinder, a water pump, a booster pump, a rock slab holder, a differential pressure sensor, a directional X-ray source, an X-ray detector, an X-ray shielding box, a tee, a liquid meter, a gas meter, an electronic balance, and a vacuum pump; the inlet of rock slab holder is respectively connected with the gas cylinder and the water pump by the pipe, the outlet is connected with the liquid meter and the vacuum pump by the tee, and the differential pressure sensor is connected with both ends of the rock slab holder; the booster pump is connected with the rock slab holder by the pipe; the inlet of the gas meter is connected with the liquid meter, and the outlet is connected to the external atmosphere.
    Type: Application
    Filed: December 30, 2022
    Publication date: May 16, 2024
    Applicant: Southwest Petroleum University
    Inventors: Zhenglan LI, Yonggang DUAN, Mingqiang WEI, Quantang FANG, Le LUO, Keyi REN, Lei MENG, Shuxin LI, Zhihong NIE
  • Patent number: 11701870
    Abstract: Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: July 18, 2023
    Inventors: Xiaosu Yi, Yan Tan, Jianfeng Tong, Qinghua Liao, Xu Chen, Feng Shi, Hu Zhang, Le Luo, Ziqing Liang, Nengwen Liu, Lingsheng Zhong
  • Patent number: 11513051
    Abstract: The present invention discloses a shale stress sensitivity testing device and method. The testing device comprises a support table. The left and right ends of the upper surface of the support table are respectively provided with a left side plate and a right side plate. The top of the left and right side plates are connected with the left and right ends of the top plate. The chucks of the clamps are capable of reciprocating motion in the horizontal direction and circular motion in the front-rear direction. The present invention can change the intensity and direction of the effective stress of the rock sample, and determine the permeability of the rock sample under different effective stresses, thus enabling comprehensive testing of the stress sensitivity of shale in different directions and enhancing the accuracy of shale stress sensitivity testing.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: November 29, 2022
    Assignee: Southwest Petroleum University
    Inventors: Mingqiang Wei, Yonggang Duan, Quantang Fang, Zhenglan Li, Le Luo, Keyi Ren, Xin Wang, Shuxin Li, Zhihong Nie
  • Publication number: 20190001640
    Abstract: Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.
    Type: Application
    Filed: December 21, 2015
    Publication date: January 3, 2019
    Inventors: Xiaosu Yi, Yan Tan, Jianfeng Tong, Qinghua Liao, Xu Chen, Feng Shi, Hu Zhang, Le Luo, Ziqing Liang, Nengwen Liu, Lingsheng Zhong
  • Patent number: 10163845
    Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: December 25, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Keng Yew Song, Yi Bin Wang, Zuo Cheng Shen, Jia Le Luo, Qing Le Tan
  • Patent number: 9889521
    Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: February 13, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Keng Yew Song, Yi Bin Wang, Qing Le Tan, Lin Wei Zheng, Jia Le Luo
  • Publication number: 20160153880
    Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 2, 2016
    Inventors: Keng Yew SONG, Yi Bin WANG, Qing Le TAN, Lin Wei ZHENG, Jia Le LUO
  • Publication number: 20150008251
    Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.
    Type: Application
    Filed: July 1, 2014
    Publication date: January 8, 2015
    Inventors: Keng Yew SONG, Yi Bin WANG, Zuo Cheng SHEN, Jia Le LUO, Qing Le TAN
  • Patent number: 8900986
    Abstract: A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: December 2, 2014
    Assignee: Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
    Inventors: Qiuping Huang, Le Luo, Gaowei Xu, Yuan Yuan
  • Publication number: 20140297763
    Abstract: A method of managing networked devices for a control point in a network system is provided. The method includes listening to a discovery message transmitted from a networked device, wherein the discovery message indicates groups corresponding to the networked device, selecting at least one networked device according to a group, and transmitting a message to the at least one networked device for instructing the at least one networked device to execute or provide its service.
    Type: Application
    Filed: June 26, 2013
    Publication date: October 2, 2014
    Inventors: JinGuang Wan, Xing Wang, Le Luo, Chia-Chieh Liu
  • Publication number: 20130273730
    Abstract: A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.
    Type: Application
    Filed: October 21, 2011
    Publication date: October 17, 2013
    Inventors: Qiuping Huang, Le Luo, Gaowei Xu, Yuan Yuan