Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may identify a multicast service available for subscription by the UE or to which the UE is already subscribed. The UE may transmit a message, to a network node, that may include UE assistance information (UAI) indicating at least one of a UE capability to process multicast transmissions or a feedback scheme preference for reporting feedback for the multicast transmissions. The UAI may also include at least one of a multicast carrier preference, band or carrier measurement report, a multicast priority indication, or a measurement and reporting scheme preference for the multicast transmissions. The network node may receive the UAI and determine one or more parameters for multicast communications with the UE based on the UAI. The UE may receive the multicast transmissions from the network node in accordance with the UAI.

Abstract: The present invention discloses a device and method for measuring the relative permeability of propped fractures in shale considering probability distribution, comprising a gas cylinder, a water pump, a booster pump, a rock slab holder, a differential pressure sensor, a directional X-ray source, an X-ray detector, an X-ray shielding box, a tee, a liquid meter, a gas meter, an electronic balance, and a vacuum pump; the inlet of rock slab holder is respectively connected with the gas cylinder and the water pump by the pipe, the outlet is connected with the liquid meter and the vacuum pump by the tee, and the differential pressure sensor is connected with both ends of the rock slab holder; the booster pump is connected with the rock slab holder by the pipe; the inlet of the gas meter is connected with the liquid meter, and the outlet is connected to the external atmosphere.

Abstract: Methods, systems, and devices for wireless communication are described. Generally, the described techniques provide for efficiently facilitating acknowledgment (ACK) or negative acknowledgment (NACK) feedback from a user equipment (UE) for a set of transport blocks in one or more multicast transmissions from a base station. The UE may determine control channel resources for transmitting the ACK/NACK feedback, and each respective control channel resource may correspond to a distinct subset of the set of transport blocks. Once the UE determines a subset of transport blocks that the UE failed to decode (such as at least one transport block), the UE may determine a respective control channel resource that corresponds to the at least one transport block that the UE failed to decode. The UE may transmit ACK/NACK feedback on the respective control channel resource, which, in some examples, may indicate that the UE failed to decode the subset of transport blocks.

Abstract: Methods, systems, and devices for wireless communications are described. A relay node may establish a control plane connection between the relay node and a base station, wherein establishing the control plane connection comprises receiving from the base station a first network identifier for the relay node. The relay node may receive, via the control plane connection, a relay configuration from the base station. The relay node may monitor grants associated with a set of one or more user equipment (UEs) based at least in part on the relay configuration, each UE comprising a network identifier that is different from the first network identifier. The relay node may relay communications between the base station and the set of one or more UEs according to the monitoring.

Abstract: A display device and a vehicle are disclosed. The display device has a display area including a plurality of display sub areas and a plurality of transparent sub areas. The display device includes a display panel and an electrochromic layer disposed on one side of the display panel. The electrochromic layer includes at least one electrochromic device, the at least one electrochromic device corresponds to at least one of the transparent sub areas, and the at least one electrochromic device transitions between transparent and opaque states.

Abstract: Aspects described herein relate to indicating downlink control information (DCI) for multicast and/or broadcast (MB) communications using DCI formats that may be based on existing DCI formats and/or size for unicast communications, paging signals, system information signals, etc., or may include shortened formats without fields for information that may not be used in MB communications.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE or a component thereof configured to receive, from a base station, SPS configuration information for broadcast and/or multicast indicating a set of resources configured for feedback, with each transmit (TX) beam of a set of TX beams corresponding to a respective subset of the set of resources. The apparatus may be further configured to receive SPS signaling from the base station via one or more TX beams of the set of TX beams over each of a set of SPS occasions. The apparatus may be further configured to transmit feedback to the base station on one or more subsets of the set of resources respectively corresponding to the one or more TX beams based on the SPS signaling, the feedback indicating one of acknowledgement (ACK) or non-acknowledgement (NACK).

Abstract: The present invention discloses a device and method for measuring the relative permeability of propped fractures in shale considering probability distribution, comprising a gas cylinder, a water pump, a booster pump, a rock slab holder, a differential pressure sensor, a directional X-ray source, an X-ray detector, an X-ray shielding box, a tee, a liquid meter, a gas meter, an electronic balance, and a vacuum pump; the inlet of rock slab holder is respectively connected with the gas cylinder and the water pump by the pipe, the outlet is connected with the liquid meter and the vacuum pump by the tee, and the differential pressure sensor is connected with both ends of the rock slab holder; the booster pump is connected with the rock slab holder by the pipe; the inlet of the gas meter is connected with the liquid meter, and the outlet is connected to the external atmosphere.

Abstract: Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.

Abstract: The present invention discloses a shale stress sensitivity testing device and method. The testing device comprises a support table. The left and right ends of the upper surface of the support table are respectively provided with a left side plate and a right side plate. The top of the left and right side plates are connected with the left and right ends of the top plate. The chucks of the clamps are capable of reciprocating motion in the horizontal direction and circular motion in the front-rear direction. The present invention can change the intensity and direction of the effective stress of the rock sample, and determine the permeability of the rock sample under different effective stresses, thus enabling comprehensive testing of the stress sensitivity of shale in different directions and enhancing the accuracy of shale stress sensitivity testing.

Abstract: Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.

Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.

Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.

Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.

Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.

Abstract: A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.

Abstract: A method of managing networked devices for a control point in a network system is provided. The method includes listening to a discovery message transmitted from a networked device, wherein the discovery message indicates groups corresponding to the networked device, selecting at least one networked device according to a group, and transmitting a message to the at least one networked device for instructing the at least one networked device to execute or provide its service.

Abstract: A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.