Patents by Inventor Le-Min Weng

Le-Min Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for operating and controlling electroless plating
    Publication number: 20030152690
    Abstract: The present invention discloses a method for operating and controlling electroless plating, which comprises plating a substrate with a plating solution, the substrate is controlled at a constant temperature between 25° C. to 200° C., and the plating solution is kept at a lower temperature than that of the substrate. According to the method of the present invention, superior depositing rates can be achieved, undesired spontaneous decomposition of the plating solution at high temperature can be avoided and no stabilizers are necessary.
    Type: Application
    Filed: February 7, 2002
    Publication date: August 14, 2003
    Inventors: Yuh Sung, Te-Hui Cheng, Ming-Der Ger, Le-Min Weng, Bing-Joe Hwang