Patents by Inventor Le Qi

Le Qi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12217734
    Abstract: The present disclosure provides an acoustic device including a microphone array, a processor, and at least one speaker. The microphone array may be configured to acquire an environmental noise. The processor may be configured to estimate a sound field at a target spatial position using the microphone array. The target spatial position may be closer to an ear canal of a user than each microphone in the microphone array. The processor may be configured to generate a noise reduction signal based on the environmental noise and the sound field estimation of the target spatial position. The at least one speaker may be configured to output a target signal based on the noise reduction signal. The target signal may be used to reduce the environmental noise. The microphone array may be arranged in a target area to minimize an interference signal from the at least one speaker to the microphone array.
    Type: Grant
    Filed: June 11, 2023
    Date of Patent: February 4, 2025
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Le Xiao, Jinbo Zheng, Chengqian Zhang, Fengyun Liao, Xin Qi
  • Publication number: 20220251108
    Abstract: The present invention provides a new class of non-immunosupressive FK506 analogs which are FKBP-selective, small-molecule BMP agonists with modest potency therepeutics for tissue repair and regeneration. Also disclosed herein are methods for making and use of these compounds.
    Type: Application
    Filed: January 23, 2020
    Publication date: August 11, 2022
    Inventors: Jun O. Liu, Zhaoli Sun, Brandon J. Peiffer, Yuefan Wang, Le Qi, Zufeng Guo, Hanjing Peng, Ali Ahmadi
  • Patent number: 10329183
    Abstract: A cutter head includes: a support platform; a double curved surface member mounted on the support platform and having a first curved surface and a second curved surface; a cutter wheel support member and a roller wheel support member moveably mounted on the support platform, respectively; a cutter wheel and a roller wheel mounted on the cutter wheel support member and the roller wheel support member, respectively; a first transmission mechanism mounted on the support platform, configured to be mated with the first curved surface, and connected to the cutter wheel support member, so as to transmit a movement of the double curved surface member to the cutter wheel; and a second transmission mechanism mounted on the support platform, configured to be mated with the second curved surface, and connected to the roller wheel support member, so as to transmit a movement of the double curved surface member to the roller wheel.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: June 25, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Le Qi, Jin Zhang, Meng Wang, Fuyuan Sun, Dongsheng Xu
  • Publication number: 20180170689
    Abstract: A substrate delivery device and a delivery method thereof are described for improving the substrate delivery efficiency, reducing abrasion in substrate delivery, and improving manufacturing efficiency of a display panel. The substrate delivery device comprises a reciprocating aligning mechanism and a screen pickup mechanism. The reciprocating aligning mechanism has a bearing platform carrying the substrate, and a first driving mechanism driving the bearing platform to move so as to bring the carried substrate to a preset position. The screen pickup mechanism has a pickup arm picking up a substrate on the reciprocating aligning mechanism, and a second driving mechanism driving the pickup arm to move. The pickup arm is located in a direction perpendicular to the substrate on the reciprocating aligning mechanism. When the reciprocating aligning mechanism moves to the preset position, the second driving mechanism drives the pickup arm to pick up the substrate on the reciprocating aligning mechanism.
    Type: Application
    Filed: May 30, 2016
    Publication date: June 21, 2018
    Inventors: Le Qi, Fuyuan Sun, Long Li, Jin Zhang, Yunlong Han, Dongsheng Xu, Bin Cao
  • Publication number: 20180022632
    Abstract: A cutter head includes: a support platform; a double curved surface member mounted on the support platform and having a first curved surface and a second curved surface; a cutter wheel support member and a roller wheel support member moveably mounted on the support platform, respectively; a cutter wheel and a roller wheel mounted on the cutter wheel support member and the roller wheel support member, respectively; a first transmission mechanism mounted on the support platform, configured to be mated with the first curved surface, and connected to the cutter wheel support member, so as to transmit a movement of the double curved surface member to the cutter wheel; and a second transmission mechanism mounted on the support platform, configured to be mated with the second curved surface, and connected to the roller wheel support member, so as to transmit a movement of the double curved surface member to the roller wheel.
    Type: Application
    Filed: July 11, 2017
    Publication date: January 25, 2018
    Inventors: Le Qi, Jin Zhang, Meng Wang, Fuyuan Sun, Dongsheng Xu
  • Patent number: D457643
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: May 21, 2002
    Inventors: Le Qi, Hongbai Choi
  • Patent number: D468435
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: January 7, 2003
    Inventors: Le Qi, James Li