Abstract: A method for synchronization of system management data includes steps of generating a request for system management data in response to execution of a system booting program, transmitting the request to a baseboard management controller so as to enable the baseboard management controller to transmit the system management data stored in a second storage unit to a processor; receiving the system management data from the baseboard management controller, and determining whether the system management data is complete; and when it is determined that the system management data is complete, storing at least one of the sequential packets of the system management data in a first storage unit, and proceeding with execution of the system booting program.

Abstract: A method for synchronization of system management data includes steps of generating a request for system management data in response to execution of a system booting program, transmitting the request to a baseboard management controller so as to enable the baseboard management controller to transmit the system management data stored in a second storage unit to a processor; receiving the system management data from the baseboard management controller, and determining whether the system management data is complete; and when it is determined that the system management data is complete, storing at least one of the sequential packets of the system management data in a first storage unit, and proceeding with execution of the system booting program.

Abstract: In a bidirectional heat sink for a package element and a method for assembling the same, the bidirectional heat sink includes a first heat-dissipating plate, a second heat-dissipating plate, and a plurality of heat-dissipating pieces. The first heat-dissipating plate is provided with a groove. Both sides of the groove are formed with two separation walls. The package element is inserted into the groove to contact the two separation walls. The second heat-dissipating plate extends from one end of the first heat-dissipating plate. Each of the heat-dissipating pieces extends from the second heat-dissipating plate in a direction away from the first heat-dissipating plat). By this structure, the contact area of the package element is increased to improve the heat-dissipating efficiency. Further, the assembling process is performed quickly to form a firm structure.