Patents by Inventor Leah J. Bagley

Leah J. Bagley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring bond pad structures
    Patent number: 9553061
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to wire bond pad structures and methods of manufacture. The structure includes: bond pads in an active region of a chip; test pad structures in a kerf region of the chip; and hardmask material in the kerf region between the test pad structures and the bond pads. The surfaces of the test pad structures and the bond pads are devoid of the hardmask material.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: January 24, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Donald R. Letourneau, Patrick S. Spinney, Leah J. Bagley, John M. Sutton