Patents by Inventor Leander Staab

Leander Staab has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering paste for hard-soldering and coating aluminum and aluminum alloys
    Patent number: 6656290
    Abstract: A soldering paste for hard-soldering and coating working parts made of aluminum or aluminum alloys, which contains 25 to 35 percent in weight of a water-miscible organic binding agent on the basis of aliphatic glycols, 25 to 45 percent in weight of an aluminum hard-soldering powder, 25 to 45 percent in weight of an aluminum fluxing agent and, as an additive to influence the rheological properties, 0.01 to 0.2 percent by weight with respect to the total amount of one or several fatty acids with 10 to 20 C atoms and/or their ammonium salts.
    Type: Grant
    Filed: July 15, 1998
    Date of Patent: December 2, 2003
    Assignee: Degussa Aktiengesellschaft
    Inventors: Jürgen Koch, Leander Staab, Wolfgang Kohlweiler, Karl-Anton Starz
  • Flux-free brazing paste
    Patent number: 6342106
    Abstract: The invention relates t a flux-free brazing paste for the brazing of copper and copper alloys. The paste includes a binder consisting of a mixture of polyisobutene with a relative molar mass from 50,000 to 500,000 and paraffin within a melting-range from 40 to 90° C.
    Type: Grant
    Filed: October 25, 2000
    Date of Patent: January 29, 2002
    Assignee: Degussa AG
    Inventors: Jürgen Koch, Sandra Wittpahl, Leander Staab
  • Flux-encased resilient solder preforms and process for the preparation thereof
    Patent number: 5984161
    Abstract: Relatively resilient flux encasings for solder preforms are obtained when a mixture of 5 to 30 wt. % potassium silicate having a molar ratio of K.sub.2 O:SiO.sub.2 ranging from 1:2.5 to 1:4.5, 0.5 to 10 wt. % concentrated phosphoric acid, 0.1 to 5 wt. % boric acid and 0 to 10 wt. % finely divided silicon dioxide, with the remainder water, is used as the binder.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: November 16, 1999
    Assignee: Degussa-Huls Aktiengesellschaft
    Inventors: Jurgen Koch, Leander Staab