Abstract: The present disclosure is directed to the packaging of metal thin films deposited on polymeric substrates. The packaging method prevents deleterious change of surface energy/water contact angle as a function of time for metal thin films such as rolls, coils, sheets or strips of sputtered or vacuum deposited metal thin films. Methods and kits directed toward a unique packaging and storage scheme are also disclosed. This results in maintenance of the metal film's hydrophilicity and surface energy for extended periods of time.

Abstract: A dynamically deployable, low visibility pneumatic cofferdam for flood mitigation is disclosed. The cofferdam includes a first planar component, a second planar component, an inflatable hermetic airbag sandwiched therebetween, and connection members attached to the first planar component, a second planar component to form a cofferdam unit. The connection members are adjustable to apply and maintain a desired amount of pressure on the airbag to enable a watertight seal to be formed. The cofferdam units may be sized and designed to sealingly mate adjacent cofferdam units in a variety of configurations to form watertight seals. The cofferdam units may also be sized and designed to attach to seawalls, flood walls, sidewalks, or other infrastructure. When in a deployed state, the height of the cofferdam may be adjusted to a desired height to provide flood mitigation. When in an undeployed state, the cofferdam remains in a substantially flat and unobtrusive position.

Abstract: The present disclosure relates to methods of creating a biosensor. A palladium film is deposited onto a surface of a substrate. The palladium film is then treated with an air plasma to stabilize the palladium and reduce or eliminate its catalytic activity. The biosensor is created from the treated palladium film and the substrate.

Abstract: A dynamically deployable, low visibility pneumatic cofferdam for flood mitigation is disclosed. The cofferdam includes a first planar component, a second planar component, an inflatable hermetic airbag sandwiched therebetween, and connection members attached to the first planar component, a second planar component to form a cofferdam unit. The connection members are adjustable to apply and maintain a desired amount of pressure on the airbag to enable a watertight seal to be formed. The cofferdam units may be sized and designed to sealingly mate adjacent cofferdam units in a variety of configurations to form watertight seals. The cofferdam units may also be sized and designed to attach to seawalls, flood walls, sidewalks, or other infrastructure. When in a deployed state, the height of the cofferdam may be adjusted to a desired height to provide flood mitigation. When in an undeployed state, the cofferdam remains in a substantially flat and unobtrusive position.

Abstract: A dynamically deployable, low visibility pneumatic cofferdam for flood mitigation is disclosed. The cofferdam includes a first planar component, a second planar component, an inflatable hermetic airbag sandwiched therebetween, and connection members attached to the first planar component, a second planar component to form a cofferdam unit. The connection members are adjustable to apply and maintain a desired amount of pressure on the airbag to enable a watertight seal to be formed. The cofferdam units may be sized and designed to sealingly mate adjacent cofferdam units in a variety of configurations to form watertight seals. The cofferdam units may also be sized and designed to attach to seawalls, flood walls, sidewalks, or other infrastructure. When in a deployed state, the height of the cofferdam may be adjusted to a desired height to provide flood mitigation. When in an undeployed state, the cofferdam remains in a substantially flat and unobtrusive position.

Abstract: The present disclosure is directed to the packaging of metal thin films deposited on polymeric substrates. The packaging method prevents deleterious change of surface energy/water contact angle as a function of time for metal thin films such as rolls, coils, sheets or strips of sputtered or vacuum deposited metal thin films. Methods and kits directed toward a unique packaging and storage scheme are also disclosed. This results in maintenance of the metal film's hydrophilicity and surface energy for extended periods of time.

Abstract: The present disclosure is directed to the packaging of metal thin films deposited on polymeric substrates. The packaging method prevents deleterious change of surface energy/water contact angle as a function of time for metal thin films such as rolls, coils, sheets or strips of sputtered or vacuum deposited metal thin films. Methods and kits directed toward a unique packaging and storage scheme are also disclosed. This results in maintenance of the metal film's hydrophilicity and surface energy for extended periods of time.

Abstract: The present disclosure relates to methods of creating a biosensor. A palladium film is deposited onto a surface of a substrate. The palladium film is then treated with an air plasma to stabilize the palladium and reduce or eliminate its catalytic activity. The biosensor is created from the treated palladium film and the substrate.

Abstract: The present disclosure is directed to the packaging of metal thin films deposited on polymeric substrates. The packaging method prevents deleterious change of surface energy/water contact angle as a function of time for metal thin films such as rolls, coils, sheets or strips of sputtered or vacuum deposited metal thin films. Methods and kits directed toward a unique packaging and storage scheme are also disclosed. This results in maintenance of the metal film's hydrophilicity and surface energy for extended periods of time.

Abstract: The invention is concerned with a process for removing residue comprising a polymeric resist and metal oxide from a metal structure on a semiconductor substrate, the process comprising the steps of: (a) heating up the substrate with the metal structure in the presence of molecular nitrogen gas (N2); (b) a stabilization step in the presence of pure molecular nitrogen gas (N2); (c) a passivation step employing a plasma containing at least one of the group of water, nitrogen and oxygen; and (d) a stripping step containing oxygen to remove the residue, comprising resist.

Abstract: The invention is concerned with a process for removing residue comprising a polymeric resist and metal oxide from a metal structure on a semiconductor substrate, the process comprising the steps of: (a) heating up the substrate with the metal structure in the presence of molecular nitrogen gas (N2); (b) a stabilization step in the presence of pure molecular nitrogen gas (N2); (c) a passivation step employing a plasma containing at least one of the group of water, nitrogen and oxygen; and (d) a stripping step containing oxygen to remove the residue, comprising resist.