Patents by Inventor Lee A. Germain

Lee A. Germain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230317576
    Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.
    Type: Application
    Filed: June 6, 2023
    Publication date: October 5, 2023
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Stephen ST. GERMAIN, Jay A. YODER, Dennis Lee CONNER, Frank Robert CERVANTES, Andrew CELAYA
  • Patent number: 11710686
    Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: July 25, 2023
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Stephen St. Germain, Jay A. Yoder, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya
  • Patent number: 4449616
    Abstract: A brake adjuster, including a pin interconnecting a brake pressure plate at one end and a metal swage at the opposite end and oriented within a deformable tube such as to radially deform the tube to the shape of the swage as the swage moves into the tube bore in response to brake wear, is rendered non-reversible to loading in the reverse direction by a washer mounted on the pin, relative to the swage, and having the circumferential geometric configuration of the tube bore such as to move easily within the bore in the swaging direction but stopped from movement in the opposite direction by the deformed portion of the tube. In alternative embodiments a tube is mounted on the pin or the pin diameter is increased to approximate the bore diameter of the deformable tube. The trailing edges of the tube or the pin adjacent the leading edge of the swage abut the deformed portion of the tube in the reverse direction to prevent motion in that direction.
    Type: Grant
    Filed: December 3, 1979
    Date of Patent: May 22, 1984
    Assignee: Goodyear Aerospace Corporation
    Inventors: Lester W. Musser, Jr., Lee A. Germain
  • Patent number: 4274549
    Abstract: A filler neck assembly is mounted to a fueling port at one end and to a fuel tank through a tank entry nipple at the opposite end, which assembly provides a fuel path into the tank and a vapor recovery path out of the tank while being serviced from a fuel dispensing nozzle having vapor recovery means. The filler neck comprises a fuel delivery tube connected to the fueling port and to the inside of the tank through a baffle within the tank entry nipple. The baffle securely seats the tube within the tank. The fuel delivery tube is coaxially mounted within the bore of an outer tube having ribs on the inside surface of its bore, the outer tube also being connected to the fueling port and to the tank entry nipple. In a second embodiment the ribs are on the outside surface of the inner fuel delivery tube while the bore of the outer tube is a smooth surface.
    Type: Grant
    Filed: September 27, 1979
    Date of Patent: June 23, 1981
    Assignee: The Goodyear Tire & Rubber Company
    Inventor: Lee A. Germain
  • Patent number: 4122968
    Abstract: A filler neck for mounting between a fueling port and a fuel tank entry nipple provides a fuel path into the tank and a vapor recovery path from the tank while being serviced from a fuel dispensing nozzle having vapor recovery means. The filler neck comprises a fuel delivery tube having a plurality of ribs on its outside surface and connected into the inside of the tank entry nipple. A sleeve tube is slipped over the fuel delivery tube and is connected at one end to the fueling port and at the other end to the outside of the tank entry nipple. The relationship between the tubes and the tank entry nipple is such that a vapor path exists in the valleys defined by the ribs on the fuel delivery tube.
    Type: Grant
    Filed: December 9, 1977
    Date of Patent: October 31, 1978
    Assignee: The Goodyear Tire & Rubber Company
    Inventor: Lee A. Germain