Abstract: An apparatus and method for an inspection apparatus for inspecting a component. The inspection apparatus including a robotic arm. A micro-XRF instrument having an instrument head coupled to the robotic arm. A seat supporting the component within a scanning area during inspection; and a computer in communication with the robotic arm and the micro-XRF instrument.

Abstract: The present application relates to an automotive cargo or a tray area cover assembly. The cover assembly includes a cover for covering a cargo or a tray area of an automobile. One or more rib supports are provided for moving over the cargo or the tray area and supporting the cover.

Abstract: A semiconductor device includes a lead frame site including a die attach region and corrugated metal leads around the die attach region. Each of the corrugated metal leads includes two or more corrugations. Each of the two or more corrugations includes a first flat horizontal portion, a first vertical portion with a first end directly adjacent and connected to a first end of the first flat horizontal portion, a second flat horizontal portion with a first end directly adjacent and connected to a second end of the first vertical portion, and a second vertical portion with a first end directly adjacent and connected to a second end of the second flat horizontal portion. The first flat horizontal portion is in a different plane than the second flat horizontal portion.

Abstract: A semiconductor device includes a lead frame site including a die attach region and corrugated metal leads around the die attach region. Each of the corrugated metal leads includes two or more corrugations. Each of the two or more corrugations includes a first flat horizontal portion, a first vertical portion with a first end directly adjacent and connected to a first end of the first flat horizontal portion, a second flat horizontal portion with a first end directly adjacent and connected to a second end of the first vertical portion, and a second vertical portion with a first end directly adjacent and connected to a second end of the second flat horizontal portion. The first flat horizontal portion is in a different plane than the second flat horizontal portion.

Abstract: A method for formation of a polymer film in-situ according to the invention comprises steps of: providing a polymerizable composition in one or multiple parts; initiating polymerization of the polymerizable composition to form a polymerizing composition; prior to completion of polymerization of the polymerizable composition, forming a film therefrom; and fully polymerizing the polymerizing composition to form the polymer film.

Abstract: An analytical device, in particular, a paper analytical device (PAD), for detection of at least two chemical components indicative of a low quality pharmaceutical product is provided. The analytical device can include a porous, hydrophilic medium, at least two assay regions associated with the porous, hydrophilic medium, at least one assay reagent or precursor thereof in the assay regions, and at least one optically readable information zone.

Abstract: A portable electronic device having an outer housing, a component, and a shock-absorption assembly is disclosed. A shock-absorption assembly located within the outer housing and coupled to the component can include one or more elements adapted to dampen a mechanical shock to the component. The shock-absorption assembly elements can be mounted to corners and/or edges of the component. Shock-absorption assembly elements can include a first portion comprising protrusions that provide initial damping of the mechanical shock and a second portion comprising an elastic block that provides final damping of the mechanical shock.

Abstract: A method for formation of a polymer film in-situ according to the invention comprises steps of: providing a polymerizable composition in one or multiple parts; prior to completion of polymerization of the polymerizable composition, forming a film therefrom; and initiating polymerization of the polymerizable composition using a radiation source to form the polymer film.

Abstract: A method for creating a high resolution print media using a display resolution screen image approval process, web-based ordering, web based checkout and payment, by an unskilled user to create a message of pre-process data and a display resolution image for rendering a high resolution image on a substrate.

Abstract: This specification discloses a mechanism that alters the cutting angle of a motorized miter saw. The cutting angle is altered by a mechanism that deploys a member from within or behind the fence to a position in front of the fence parallel to the blade and partially within a cavity/opening in the material resting surface. When deployed in front of the fence, the angle between the blade and cutting material is altered.

Abstract: An analytical device, in particular, a paper analytical device (PAD), for detection of at least two chemical components indicative of a low quality pharmaceutical product is provided. The analytical device can include a porous, hydrophilic medium, at least two assay regions associated with the porous, hydrophilic medium, at least one assay reagent or precursor thereof in the assay regions, and at least one electronically readable information zone.

Abstract: A portable electronic device having an outer housing, a component, and a shock-absorption assembly is disclosed. A shock-absorption assembly located within the outer housing and coupled to the component can include one or more elements adapted to dampen a mechanical shock to the component. The shock-absorption assembly elements can be mounted to corners and/or edges of the component. Shock-absorption assembly elements can include a first portion comprising protrusions that provide initial damping of the mechanical shock and a second portion comprising an elastic block that provides final damping of the mechanical shock.

Abstract: A portable computing device having an outer housing, and internal hard disk drive and a shock damping mounting assembly is disclosed. Multiple outer dimensions of the portable computing device can be less than the width of the hard drive due to a diagonal arrangement of the hard drive within the overall device. The hard drive can comply with a standardized form factor, such as a 3.5 inch form factor. A mounting assembly located within the outer housing and coupled to the hard drive can include one or more components adapted to damp a mechanical shock to the hard drive, which components can be mounted to corners and/or edges of the hard drive. Mounting assembly components can includes a first stage spring comprising a finger geometry that provides initial damping of the mechanical shock and a second stage spring comprising an elastic block that provides final damping of the mechanical shock.

Abstract: This specification discloses a mechanism that alters the cutting angle of a motorized miter saw. The cutting angle is altered by a mechanism that deploys a member from underneath the cutting material resting surface to above the cutting material resting surface. When deployed above the cutting material resting surface, the angle between the blade and cutting material is altered.

Abstract: A method for formation of a polymer film in-situ according to the invention comprises steps of: providing a polymerizable composition in one or multiple parts; prior to completion of polymerization of the polymerizable composition, forming a film therefrom; and initiating polymerization of the polymerizable composition using a radiation source to form the polymer film.

Abstract: A portable computing device having an outer housing, and internal hard disk drive and a shock damping mounting assembly is disclosed. Multiple outer dimensions of the portable computing device can be less than the width of the hard drive due to a diagonal arrangement of the hard drive within the overall device. The hard drive can comply with a standardized form factor, such as a 3.5 inch form factor. A mounting assembly located within the outer housing and coupled to the hard drive can include one or more components adapted to damp a mechanical shock to the hard drive, which components can be mounted to corners and/or edges of the hard drive. Mounting assembly components can includes a first stage spring comprising a finger geometry that provides initial damping of the mechanical shock and a second stage spring comprising an elastic block that provides final damping of the mechanical shock.

Abstract: A method for formation of a polymer film in-situ according to the invention comprises steps of: providing a polymerizable composition in one or multiple parts; initiating polymerization of the polymerizable composition to form a polymerizing composition; prior to completion of polymerization of the polymerizable composition, forming a film therefrom; and fully polymerizing the polymerizing composition to form the polymer film.

Abstract: A power saw that has a device that allows for small changes in miter angles, where the small changes in miter angels can be made quickly as well as removed quickly. Additional the device makes it clear whether the angle adjustment is or is not in place.

Abstract: An device that allows air flow while attenuating sound for the purposes of allowing air to flow between rooms in a structure such as a house or building. The device consists of an air passageway that attenuates sound and covers at each end of the passageway. The covers allow air flow while providing an aesthetically pleasing appearance. Multiple embodiments support pre and post construction scenarios as well access to the interior of the device for cleaning purposes.

Abstract: A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.