Abstract: A semiconductor device is provided. The semiconductor device includes a first gate line, a second gate line, a first contact electrode, first dummy gates, a second gate pad, and a second contact electrode. The first gate line is formed on a semiconductor substrate and the second gate line of a spacer shape is formed on the sidewalls of the first gate line with a thin insulating layer interposed therebetween. The first contact electrode is vertically connected with the first gate line. The first dummy gates are formed in array spaced a predetermined interval from the first gate line on the semiconductor substrate. The second gate pad of a spacer shape is formed on the sidewalls of the first dummy gates with a thin insulating layer interposed therebetween. The second gate pad is connected to the second gate line and is also gap-filled between the first dummy gates. The second contact electrode is vertically connected with the second gate pad.