Patents by Inventor Lee C. Kuan

Lee C. Kuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • U-shape tape for BOC FBGA package to improve moldability
    Patent number: 6617201
    Abstract: An FBGA packaged device including a die adhered to a substrate with a small gap being formed between the die and substrate. An opening is formed through the substrate adjacent the center portion of the die. An encapsulating mold is formed around the die extending into the gap and also filling the channel. At least one barrier is disposed in the gap between the substrate and the die adjacent the channel to control the flow path of the encapsulating material as the mold is formed in the package.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: September 9, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Lim T. Chye, Lee C. Kuan, Jeffrey Toh, Tim Teoh, Patrick Guay, Choong L. Wah
  • U-shape tape for BOC FBGA package to improve moldability
    Publication number: 20030025185
    Abstract: An FBGA packaged device including a die adhered to a substrate with a small gap being formed between the die and substrate. An opening is formed through the substrate adjacent the center portion of the die. An encapsulating mold is formed around the die extending into the gap and also filling the channel. At least one barrier is disposed in the gap between the substrate and the die adjacent the channel to control the flow path of the encapsulating material as the mold is formed in the package.
    Type: Application
    Filed: September 30, 2002
    Publication date: February 6, 2003
    Inventors: Lim T. Chye, Lee C. Kuan, Jeffrey Toh, Tim Teoh, Patrick Guay, Choong L. Wah
  • U-shape tape for BOC FBGA package to improve moldability
    Patent number: 6486536
    Abstract: An FBGA packaged device including a die adhered to a substrate with a small gap being formed between the die and substrate. An opening is formed through the substrate adjacent the center portion of the die. An encapsulating mold is formed around the die extending into the gap and also filling the channel. At least one barrier is disposed in the gap between the substrate and the die adjacent the channel to control the flow path of the encapsulating material as the mold is formed in the package.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: November 26, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Lim T. Chye, Lee C. Kuan, Jeffery Toh, Tim Teoh, Patrick Guay, Choong L. Wah