Patents by Inventor Lee Capper

Lee Capper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8262811
    Abstract: For producing corrosion resistant yellow passivate layers on zinc and zinc alloy surfaces, an aqueous reaction solution is utilized that contains trivalent chromium ions, at least one acid as well as at least one heteroaromatic compound selected from the group comprising nicotinic acid, the salts and derivatives thereof.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: September 11, 2012
    Assignee: Atotech Deutschland GmbH
    Inventors: Lee Capper, Andreas Noack
  • Publication number: 20090032146
    Abstract: For producing corrosion resistant yellow passivate layers on zinc and zinc alloy surfaces, an aqueous reaction solution is utilized that contains trivalent chromium ions, at least one acid as well as at least one heteroaromatic compound selected from the group comprising nicotinic acid, the salts and derivatives thereof.
    Type: Application
    Filed: January 23, 2007
    Publication date: February 5, 2009
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Lee Capper, Andreas Noack
  • Publication number: 20050189231
    Abstract: An electroplating bath, a system, a process for, and the article obtained from, depositing a zinc-nickel ternary or higher alloy, a) zinc ions; b) nickel ions; and c) one or more ionic species selected from ions of Te+4, Bi+3 and Sb+3, and in some embodiments, further including one or more additional ionic species selected from ions of Bi+3, Sb+3, Ag+1, Cd+2, Co+2, Cr+3, Cu+2, Fe+2, In+3, Mn+2, Mo+6, P+3, Sn+2 and W+6. In some embodiments, the system includes a divider forming a cathodic chamber and an anodic chamber, with the electroplating bath in the cathodic chamber only. In various embodiments, the zinc-nickel ternary and higher alloys may provide improved properties to the conductive substrates upon which the alloys are deposited.
    Type: Application
    Filed: February 26, 2004
    Publication date: September 1, 2005
    Inventors: Lee Capper, Vincent Opaskar, Paul Wynn, Craig Bishop