Patents by Inventor Lee Chen
Lee Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250139360Abstract: This disclosure enables various technologies that can (1) learn new synonyms for a given concept without manual curation techniques, (2) relate (e.g., map) some, many, most, or all raw named entity recognition outputs (e.g., “United States”, “United States of America”) to ontological concepts (e.g., ISO-3166 country code: “USA”), (3) account for false positives from a prior named entity recognition process, or (4) aggregate some, many, most, or all named entity recognition results from machine learning or rules based approaches to provide a best of breed hybrid approach (e.g., synergistic effect).Type: ApplicationFiled: January 3, 2025Publication date: May 1, 2025Inventors: Richard Edward Wendell, Eric Tanalski, Henry Edward Crosby, III, Loren Lee Chen, Paul Ton, Jake Rubenstein
-
Publication number: 20250132127Abstract: An apparatus, comprising: a process chamber, wherein the process chamber comprises: a window, wherein the window comprises a dielectric material that is transmissive to radio frequency (RF) energy, wherein the window has a first side and a second side opposite the first side; a collar assembly having an aperture covered by the window, wherein the collar assembly supports the first side of the window; and one or more RF coils positioned above the second side of the window, wherein, when viewed along a first axis perpendicular to the window, a radial distance between an outermost portion of the one or more RF coils and an innermost portion of an electrically conductive portion of the collar assembly that intersects with a first reference plane that is perpendicular to the first axis and between the first side of the window and the one or more RF coils is greater than or equal to 40 mm.Type: ApplicationFiled: August 5, 2022Publication date: April 24, 2025Inventors: Tongtong Guo, Rachel E. Batzer, Lee Chen, Francisco J. Juarez, Andrew John McKerrow, Bo Gong, Malak Khojasteh, Zhe Gui, Huatan Qiu
-
Patent number: 12283462Abstract: An apparatus for forming a plasma may include one or more coupling ports to accept a radiofrequency (RF) current. The apparatus may additionally include one or more coupling structures which may include one or more conductive loops to permit the RF current to conduct from at least a first portion of the one or more coupling ports to at least a second port of the one or more coupling ports. The one or more conductive loops may each be configured to exhibit a first value of inductance in the absence of the plasma and to exhibit a second value of inductance in the presence of the plasma. The one or more coupling structures may each include a reactive element, in which each reactive element is coupled to a corresponding one of the one or more conductive loops so as to form a corresponding number of coupling structures. Each RF coupling structure may have a resonant frequency that increases in response to the presence of the plasma.Type: GrantFiled: June 7, 2021Date of Patent: April 22, 2025Assignee: Lam Research CorporationInventors: Hema Swaroop Mopidevi, Lee Chen, Thomas W. Anderson, Shaun Tyler Smith, Neil M. P. Benjamin
-
Patent number: 12198896Abstract: An RF antenna is configured, when powered, to inductively generate plasma in a process region of a chamber, including: an array of parallel conductive lines that are oriented along a plane, the array including a first conductive line, a second conductive line, a third conductive line, and a fourth conductive line; wherein the first and second conductive lines are adjacent, wherein the second and third conductive lines are adjacent, and wherein the third and fourth conductive lines are adjacent; wherein when the RF antenna is powered, current flow in the adjacent first and second conductive lines occurs in an opposite direction, current flow in the adjacent second and third conductive lines occurs in a same direction, current flow in the adjacent third and fourth conductive lines occurs in an opposite direction.Type: GrantFiled: July 26, 2019Date of Patent: January 14, 2025Assignee: Lam Research CorporationInventors: Roger Patrick, Neil M. P. Benjamin, Lee Chen, Alan Schoepp, Clint Edward Thomas, Thomas W. Anderson, Sang Heon Song
-
Patent number: 12190057Abstract: This disclosure enables various technologies that can (1) learn new synonyms for a given concept without manual curation techniques, (2) relate (e.g., map) some, many, most, or all raw named entity recognition outputs (e.g., “United States”, “United States of America”) to ontological concepts (e.g., ISO-3166 country code: “USA”), (3) account for false positives from a prior named entity recognition process, or (4) aggregate some, many, most, or all named entity recognition results from machine learning or rules based approaches to provide a best of breed hybrid approach (e.g., synergistic effect).Type: GrantFiled: February 5, 2021Date of Patent: January 7, 2025Assignee: Tellic LLCInventors: Richard Edward Wendell, Eric Tanalski, Henry Edward Crosby, III, Loren Lee Chen, Paul Ton, Jake Rubenstein
-
Publication number: 20240403556Abstract: This disclosure enables various technologies that can (1) learn new synonyms for a given concept without manual curation techniques, (2) relate (e.g., map) some, many, most, or all raw named entity recognition outputs (e.g., “United States”, “United States of America”) to ontological concepts (e.g., ISO-3166 country code: “USA”), (3) account for false positives from a prior named entity recognition process, or (4) aggregate some, many, most, or all named entity recognition results from machine learning or rules based approaches to provide a best of breed hybrid approach (e.g., synergistic effect).Type: ApplicationFiled: August 9, 2024Publication date: December 5, 2024Inventors: Richard Edward Wendell, Eric Tanalski, Christopher Russel Sipola, Michael Stanley, Henry Edward Crosby, Loren Lee Chen, Paul Ton
-
Patent number: 12061870Abstract: This disclosure enables various technologies that can (1) learn new synonyms for a given concept without manual curation techniques, (2) relate (e.g., map) some, many, most, or all raw named entity recognition outputs (e.g., “United States”, “United States of America”) to ontological concepts (e.g., ISO-3166 country code: “USA”), (3) account for false positives from a prior named entity recognition process, or (4) aggregate some, many, most, or all named entity recognition results from machine learning or rules based approaches to provide a best of breed hybrid approach (e.g., synergistic effect).Type: GrantFiled: October 29, 2020Date of Patent: August 13, 2024Assignee: Tellic LLCInventors: Richard Edward Wendell, Eric Tanalski, Christopher Russel Sipola, Michael Stanley, Henry Edward Crosby, Loren Lee Chen, Paul Ton
-
Patent number: 12050357Abstract: A cable distribution box includes a base plate, a proximal wall extending from a first side of the base plate, a distal wall extending from a second side of the base plate, a latch formed on a third side of the base plate, and a cover plate extending from the proximal wall. The latch is configured to secure the cable distribution box to a chassis. The cover plate has a center portion that projects towards the base plate, such that the center portion is configured to wrap a cable thereon. The cover plate is foldable along a length of the proximal wall, relative to the base plate in a clamshell fashion, to enclose the wrapped cable between the cover plate and the base plate. The cover plate includes a locking mechanism that is configured to engage the distal wall, and secure the cover plate onto the base plate.Type: GrantFiled: March 21, 2022Date of Patent: July 30, 2024Assignee: QUANTA COMPUTER INC.Inventors: Yaw-Tzorng Tsorng, Chen-Chien Kuo, Tang-Shun-Lee Chen, Bo-Sheng Tsai
-
Patent number: 11862886Abstract: A connector clip is disclosed. The connector clip includes a base, a cover, a hinge coupling the cover and the base, and a fastener. The base has a first base side joined to a second base side via a connecting base side. The cover has a first cover side joined to a second cover side via a connecting cover side. The fastener holds the first base side and the first cover side in a fixed position when the connector clip is in a closed configuration in which the connecting base side is parallel to the connecting cover side. An internal cable opening is formed in part by the connecting base side and the connecting cover side when the connector clip is in the closed configuration. The connector clip secures a cable passing through the internal cable opening and connected to a board in its place in the closed configuration.Type: GrantFiled: February 23, 2022Date of Patent: January 2, 2024Assignee: QUANTA COMPUTER INC.Inventors: Yaw-Tzorng Tsorng, Chen-Chien Kuo, Tang-Shun-Lee Chen, Chin-Yu Lin
-
Publication number: 20230326720Abstract: An apparatus for forming a plasma may include one or more coupling ports to accept a radiofrequency (RF) current. The apparatus may additionally include one or more coupling structures which may include one or more conductive loops to permit the RF current to conduct from at least a first portion of the one or more coupling ports to at least a second port of the one or more coupling ports. The one or more conductive loops may each be configured to exhibit a first value of inductance in the absence of the plasma and to exhibit a second value of inductance in the presence of the plasma. The one or more coupling structures may each include a reactive element, in which each reactive element is coupled to a corresponding one of the one or more conductive loops so as to form a corresponding number of coupling structures. Each RF coupling structure may have a resonant frequency that increases in response to the presence of the plasma.Type: ApplicationFiled: June 7, 2021Publication date: October 12, 2023Inventors: Hema Swaroop Mopidevi, Lee Chen, Thomas W. Anderson, Shaun Tyler Smith, Neil M.P. Benjamin
-
Patent number: 11728135Abstract: This disclosure relates to a plasma processing system for controlling plasma density near the edge or perimeter of a substrate that is being processed. The plasma processing system may include a plasma chamber that can receive and process the substrate using plasma for etching the substrate, doping the substrate, or depositing a film on the substrate. This disclosure relates to a plasma processing system for controlling plasma density near the edge or perimeter of a substrate that is being processed. In one embodiment, the plasma density may be controlled by reducing the rate of loss of ions to the chamber wall during processing. This may include biasing a dual electrode ring assembly in the plasma chamber to alter the potential difference between the chamber wall region and the bulk plasma region.Type: GrantFiled: November 4, 2015Date of Patent: August 15, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Jianping Zhao, Lee Chen, Merritt Funk, Zhiying Chen
-
Publication number: 20230231334Abstract: A connector clip is disclosed. The connector clip includes a base, a cover, a hinge coupling the cover and the base, and a fastener. The base has a first base side joined to a second base side via a connecting base side. The cover has a first cover side joined to a second cover side via a connecting cover side. The fastener holds the first base side and the first cover side in a fixed position when the connector clip is in a closed configuration in which the connecting base side is parallel to the connecting cover side. An internal cable opening is formed in part by the connecting base side and the connecting cover side when the connector clip is in the closed configuration. The connector clip secures a cable passing through the internal cable opening and connected to a board in its place in the closed configuration.Type: ApplicationFiled: February 23, 2022Publication date: July 20, 2023Inventors: Yaw-Tzorng TSORNG, Chen-Chien KUO, Tang-Shun-Lee CHEN, Chin-Yu LIN
-
Publication number: 20230223238Abstract: An apparatus for forming a plasma may include one or more coupling ports to accept and RF current. The apparatus may additionally include a receptacle to accommodate one or more gases, in which the receptacle is oriented along a first axis. The apparatus may additionally include an RF coupling structure, oriented in a plane and substantially surrounding the receptacle, the RF coupling structure can be configured to conduct an RF current to bring about formation of the plasma within the receptacle. The apparatus may further include one or more linkages, coupled to the RF coupling structure, which may permit the plane of the RF coupling structure to pivot about a second axis so as to tilt the plane of the RF coupling structure toward the first axis.Type: ApplicationFiled: April 30, 2021Publication date: July 13, 2023Inventors: Tongtong Guo, Rachel E. Batzer, Huatan Qiu, Lee Chen, Bo Gong, Zhe Gui
-
Publication number: 20230204889Abstract: A cable distribution box includes a base plate, a proximal wall extending from a first side of the base plate, a distal wall extending from a second side of the base plate, a latch formed on a third side of the base plate, and a cover plate extending from the proximal wall. The latch is configured to secure the cable distribution box to a chassis. The cover plate has a center portion that projects towards the base plate, such that the center portion is configured to wrap a cable thereon. The cover plate is foldable along a length of the proximal wall, relative to the base plate in a clamshell fashion, to enclose the wrapped cable between the cover plate and the base plate. The cover plate includes a locking mechanism that is configured to engage the distal wall, and secure the cover plate onto the base plate.Type: ApplicationFiled: March 21, 2022Publication date: June 29, 2023Inventors: Yaw-Tzorng TSORNG, Chen-Chien KUO, Tang-Shun-Lee CHEN, Bo-Sheng TSAI
-
Publication number: 20230207274Abstract: A substrate processing system includes a gas source, an RF source, and a light source. The gas source supplies a first gas to a process module of the substrate processing system. The RF source supplies RF power to the process module to generate plasma when the first gas is supplied to the process module of the substrate processing system. The light source is coupled to the process module to introduce light into the process module during the plasma generation.Type: ApplicationFiled: May 21, 2021Publication date: June 29, 2023Inventors: Lee CHEN, Ramesh CHANDRASEKHARAN, Shaun Tyler SMITH, Yukinori SAKIYAMA, Aaron DURBIN, Jon HENRI
-
Publication number: 20230039937Abstract: This disclosure enables various technologies that can (1) learn new synonyms for a given concept without manual curation techniques, (2) relate (e.g., map) some, many, most, or all raw named entity recognition outputs (e.g., “United States”, “United States of America”) to ontological concepts (e.g., ISO-3166 country code: “USA”), (3) account for false positives from a prior named entity recognition process, or (4) aggregate some, many, most, or all named entity recognition results from machine learning or rules based approaches to provide a best of breed hybrid approach (e.g., synergistic effect).Type: ApplicationFiled: February 5, 2021Publication date: February 9, 2023Inventors: Richard Edward Wendell, Eric Tanalski, Henry Edward Crosby, III, Loren Lee Chen, Paul Ton, Jake Rubenstein
-
Publication number: 20220398378Abstract: This disclosure enables various technologies that can (1) learn new synonyms for a given concept without manual curation techniques, (2) relate (e.g., map) some, many, most, or all raw named entity recognition outputs (e.g., “United States”, “United States of America”) to ontological concepts (e.g., ISO-3166 country code: “USA”), (3) account for false positives from a prior named entity recognition process, or (4) aggregate some, many, most, or all named entity recognition results from machine learning or rules based approaches to provide a best of breed hybrid approach (e.g., synergistic effect).Type: ApplicationFiled: October 29, 2020Publication date: December 15, 2022Inventors: Richard Edward Wendell, Eric Tanalski, Christopher Russel Sipola, III, Michael Stanley, Henry Edward Crosby, Loren Lee Chen, Paul Ton
-
Publication number: 20220246428Abstract: A substrate processing tool capable of forming an carbon layer on a substrate by generating a plasma including carbon and non-carbon ions in a processing chamber, suspending the carbon and non-carbon ions in the processing chamber, removing mostly the suspended non-carbon ions from the processing chamber, and bombarding the substrate surface with mostly carbon ions. The one or more steps of the above sequence may be repeated until the carbon layer is of desired thickness.Type: ApplicationFiled: June 25, 2020Publication date: August 4, 2022Inventors: Karl Frederick LEESER, Lee CHEN, Yukinori SAKIYAMA
-
Publication number: 20220119954Abstract: A plasma tool in which the generation of two or more plasmas in a processing chamber used for processing a substrate is modulated either temporally, spatially, or both. The modulation of the two plasmas is used for the formation of Diamond Like Carbon (DLC) layers on substrates. One plasma is used for forming an amorphous carbon layer, while the second plasma is used for converting the amorphous carbon layer to a DLC by ion bombardment.Type: ApplicationFiled: January 28, 2020Publication date: April 21, 2022Inventors: Lee CHEN, Yukinori SAKIYAMA, Karl Frederick LEESER
-
Patent number: RE49053Abstract: Provided is a method and system for TCP SYN cookie validation. The method includes receiving a session SYN packet by a TCP session setup module of a host server, generating a transition cookie including a time value representing the actual time, sending a session SYN/ACK packet, including the transition cookie, in response to the received session SYN packet, receiving a session ACK packet, and determining whether a candidate transition cookie in the received session ACK packet comprises a time value representing a time within a predetermined time interval from the time the session ACK packet is received.Type: GrantFiled: December 28, 2018Date of Patent: April 26, 2022Assignee: A10 Networks, Inc.Inventors: Lee Chen, Ronald Wai Lun Szeto, Shih-Tsung Hwang