Abstract: This application is directed to heat dissipation for interconnect transceivers applied in a server system. A server rack includes a rack structure for supporting one or more rack servers and a switch box mechanically mounted on the rack structure. The switch box is configured to receive detachable optical interconnects, and includes a transceiver module and a cooling structure coupled to the transceiver module. The transceiver module is configured to convert incoming signals to outgoing signals and generate heat while converting the incoming signals. The cooling structure is configured to inject a coolant via an inlet and output the coolant via an outlet, thereby allowing the coolant to at least partially carry away the heat generated by the transceiver module. In some embodiments, the cooling structure includes a metallic plate, which comes into contact with the transceiver module via a contact surface for absorbing the heat generated by the transceiver module.

Abstract: A sealing structure for an immersion cooling apparatus housing and cooling an optoelectronic processing device includes a first lid portion, a second lid portion detachably connected to the first lid portion, and a sealing component. The sealing component includes a first sealing part disposed on the first lid portion and a second sealing part disposed on the second lid portion. The first lid portion, the second lid portion, and the sealing component jointly define a sealing lid hermetically covering an opening portion of a tank body included in the immersion cooling apparatus. Part of optical fibers included in the optoelectronic processing device are sandwiched between and encompassed by the first sealing part and the second sealing part.