Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract: An embodiment of the invention introduces a method for generating schematic diagrams, executed by a processing unit of an apparatus, which comprises the following steps. A pin-editing interface comprising a data table is generated to assist a user to configure pin settings. A user setting is obtained via the pin-editing interface, and a schematic diagram is generated on a display unit according to the obtained user setting.

Abstract: An embodiment of the invention introduces a method for generating schematic diagrams, executed by a processing unit of an apparatus, which comprises the following steps. A pin-editing interface comprising a data table is generated to assist a user to configure pin settings. A user setting is obtained via the pin-editing interface, and a schematic diagram is generated on a display unit according to the obtained user setting.

Abstract: A computer-aided thermal relief pad design system includes a depicting unit, a memory unit and a calculating unit. The depicting unit is used for depicting an elongated oval pattern of a thermal relief pad. The elongated oval pattern includes two perpendicular axes that intersect at a center point, and a plurality of terminals. The memory unit is used for storing formulae defining relationships between lengths of the two axes and coordinates of the terminals. The coordinates of the terminal define positions of the terminals relative to the center point. The calculating unit is used for calculating the coordinates of the terminals based on the formulae stored in the memory unit.

Abstract: A computer-aided thermal relief pad design system includes a depicting unit, a memory unit and a calculating unit. The depicting unit is used for depicting an elongated oval pattern of a thermal relief pad. The elongated oval pattern includes two perpendicular axes that intersect at a center point, and a plurality of terminals. The memory unit is used for storing formulae defining relationships between lengths of the two axes and coordinates of the terminals. The coordinates of the terminal define positions of the terminals relative to the center point. The calculating unit is used for calculating the coordinates of the terminals based on the formulae stored in the memory unit.