Patents by Inventor Lee Chung

Lee Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110280277
    Abstract: Systems and methods for extending the range of a fiber optic DTS system are provided. In one respect, a method may provide steps for transmitting, in a first time period, an optical signal at a first energy level through an optical fiber, collecting backscatter signals as a result of the first transmission, adjusting the first energy level to a second energy level, transmitting, in an additional time period, the adjusted optical signal through the optical fiber, collecting backscatter signals as a result of the adjusted transmissions, and using a portion of the collected backscatter as a result of the first transmission and a portion of the collected backscatter as a result of the additional transmissions, determining one or more parameter profiles, such as a temperature profile.
    Type: Application
    Filed: January 17, 2009
    Publication date: November 17, 2011
    Inventors: Lee Chung, Kalar Kent, Mahesh Ajgaonkar, Michael Sanders
  • Publication number: 20070020778
    Abstract: A 3-dimensional PCM structure and method for using the same for carrying out 3-dimensional integrated circuit wiring electrical testing and failure analysis in an integrated circuit manufacturing process, the method including forming a first metallization layer; carrying out a first wafer acceptance testing (WAT) process to test the electrical continuity of the first metallization layer; forming first metal vias on the first metallization layer conductive portions and a second metallization layer comprising metal islands on the first metal vias wherein the metal islands electrically communicate with the first metallization layer to form a process control monitor (PCM) structure; and, carrying out a second WAT process to test the electrical continuity of the first metallization layer.
    Type: Application
    Filed: July 25, 2005
    Publication date: January 25, 2007
    Inventors: Cheng Yi, Chiou Yean, Hung-Hon Lui, Lee Chung
  • Patent number: 6042736
    Abstract: The present invention provides a method for preparing samples for microscopic examination that requires a glass slide to be laminated to a sample substrate by an adhesive layer for polishing in a sample polishing process. A cavity can be first formed in the surface of the substrate by a focused ion beam technique to reveal a characteristic feature which needs to be examined. A wax-based material is then used to fill the cavity and to protect the characteristic feature before an adhesive layer is applied on top of the substrate for bonding a glass slide to the substrate. After the sample is sectioned in the polishing process to reveal a new cross-section that contains the characteristic feature, the protective coating of the wax-based material can be removed by a suitable solvent such that the characteristic feature is ready for microscopic examination. A suitable wax-based material can be a wax that is similar to a candle wax which can be easily removed by acetone.
    Type: Grant
    Filed: November 17, 1997
    Date of Patent: March 28, 2000
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Lee Chung
  • Patent number: 6007409
    Abstract: The present invention discloses a sample holder for a miniature device for use in a parallel lapping tool that is equipped with a hollow-centered sample holder assembly such that the condition of the sample being prepared can be continuously monitored from either the top side or the bottom side of the holder, and at least three adjusting screws that are used to adjust a plane of lapping to be the same as the plane of interest in said miniature device to be observed such that once the plane is obtained, only the sample displacement knob situated at the center of the holder needs to be adjusted to further advance the sample for removal of more material.
    Type: Grant
    Filed: April 8, 1998
    Date of Patent: December 28, 1999
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Lee Chung