Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides or detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: A surface inspection system and methods of inspecting a surface of a workpiece are provided for detecting particles, defects, or other surface characteristics in or on a surface of the workpiece. The surface inspection system preferably has a transporter arranged for transporting a workpiece along a material path and a rotator associated with the transporter and arranged for rotating a workpiece during translational travel along the material path. A scanner is positioned and arranged for scanning a surface of a workpiece during rotational and translational travel along the material path. The scanner preferably includes a light source arranged to generate a light beam therefrom and a deflector positioned to receive the light beam and arranged for deflecting the light beam along a predetermined scan path across a surface of the workpiece as the workpiece rotationally and translationally travels along the material path.

Abstract: The particle detection system detects particles or flaws on the surface of an article. The system has a source of light directed against the surface of the article and a detector for detecting light scattered from the article and indicative of the presence of particles or flaws present on the article. The detector includes a light collector positioned for receiving and collecting light scattered from the surface of the article, a light splitter cooperating with the collector for dividing the collected light into first and second light collect components, first and second photodetectors positioned for receiving respectively first and second like light components, and an electrical circuit for combining the output signals from the first and second photodetectors to form a combined output signal with a higher signal-to-noise ratio than traditional systems.