Patents by Inventor Lee D. Whetsel

Lee D. Whetsel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220137134
    Abstract: The present disclosure describes novel methods and apparatuses for directly accessing JTAG Tap domains that exist in a scan path of many serially connected JTAG Tap domains. Direct scan access to a selected Tap domain by a JTAG controller is achieved using auxiliary digital or analog terminals associated with the Tap domain and connected to the JTAG controller. During direct scan access, the auxiliary digital or analog terminals serve as serial data input and serial data output paths between the selected Tap domain and the JTAG controller.
    Type: Application
    Filed: January 12, 2022
    Publication date: May 5, 2022
    Inventor: Lee D. Whetsel
  • Publication number: 20220113351
    Abstract: Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Inventor: Lee D. Whetsel
  • Publication number: 20220113348
    Abstract: An integrated circuit die includes a substrate of semiconductor material having a top surface, a bottom surface, and an opening through the substrate between the top surface and the bottom surface. A through silicon via (TSV) has a conductive body in the opening, has a top contact point coupled to the body at the top surface, and has a bottom contact point coupled to the body at the bottom surface. A scan cell has a serial input, a serial output, control inputs, a voltage reference input, a response input coupled to one of the contact points, and a stimulus output coupled to the other one of the contact points.
    Type: Application
    Filed: December 21, 2021
    Publication date: April 14, 2022
    Inventor: Lee D. Whetsel
  • Patent number: 11302591
    Abstract: The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of die. The testing is facilitated by test circuitry associated with each type of TSV. The test circuitry includes a scan cell adapted for testing TSVs.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: April 12, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Publication number: 20220107362
    Abstract: This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.
    Type: Application
    Filed: December 15, 2021
    Publication date: April 7, 2022
    Inventor: Lee D. Whetsel
  • Patent number: 11287473
    Abstract: This disclosure describes different ways to improve the operation of a device's 1149.1 TAP to where the TAP can perform at-speed Update & Capture, Shift & Capture and Back to Back Capture & Shift operations. In a first embodiment of the disclosure the at-speed operations are achieved by time division multiplexing CMD signals onto the TMS input to the TAP. The CMD signals are input to a CMD circuit that operates in conjunction with a Dual Port Router to execute the at-speed operations of a circuit. In a second embodiment of the disclosure the at-speed operations are achieved by detecting the TAP's Exit1DR state as a CMD signal that is input to the CMD circuit that operates in conjunction with a Dual Port Router to execute the at-speed operations of a circuit.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: March 29, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Patent number: 11275116
    Abstract: Testing of an electrical device is achieved by providing a test access mechanism within the device that can receive scan frames from an external tester. The received scan frames contain stimulus data to be applied to circuitry within the device to be tested, a command for enabling a test control operation, and a frame marker bit to indicate the end of the scan frame pattern. The inputting of scan frames can occur continuously and simultaneous with a commanded test control operation.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: March 15, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Publication number: 20220074989
    Abstract: The disclosure describes novel methods and apparatuses for accessing test compression architectures (TCA) in a device using either a parallel or serial access technique. The serial access technique may be controlled by a device tester or by a JTAG controller. Further the disclosure provides an approach to access the TCA of a device when the device exists in a daisy-chain arrangement with other devices, such as in a customer's system. Additional embodiments are also provided and described in the disclosure.
    Type: Application
    Filed: November 17, 2021
    Publication date: March 10, 2022
    Inventor: Lee D. Whetsel
  • Patent number: 11269008
    Abstract: The disclosure describes a novel method and apparatus for improving the operation of a TAP architecture in a device through the use of Command signal inputs to the TAP architecture. In response to a Command signal input, the TAP architecture can perform streamlined and uninterrupted Update, Capture and Shift operation cycles to a target circuit in the device or streamlined and uninterrupted capture and shift operation cycles to a target circuit in the device. The Command signals can be input to the TAP architecture via the devices dedicated TMS or TDI inputs or via a separate CMD input to the device.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: March 8, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Publication number: 20220065930
    Abstract: The disclosure provides a novel method and apparatus for inputting addresses to devices to select the device TAP for access. Further, the disclosure provides a novel method and apparatus for inputting addresses for selecting device TAPs and for inputting commands for commanding circuitry within the device. The inputting of addresses or the inputting of addresses and commands is initiated by a control bit input on TDI that is recognized during the Run Test/Idle, Pause-DR or Pause-IR TAP states.
    Type: Application
    Filed: November 9, 2021
    Publication date: March 3, 2022
    Inventor: Lee D. Whetsel
  • Patent number: 11262402
    Abstract: An address and command port interface selectively enables JTAG TAP domain operations and Trace domain operations within an IC. The port carries TMS and TDI input and TDO output on a single pin and receives a clock signal on a separate pin. The addressable two pin interface loads and updates instructions and data to the TAP domain within the IC. The instruction or data update operations in multiple ICs occur simultaneously. A process transmits data from an addressed target device to a controller using data frames, each data frame comprising a header bit and data bits. The logic level of the header bit is used to start, continue, and stop the data transmission to the controller. A data and clock signal interface between a controller and multiple target devices provides for each target device to be individually addressed and commanded to perform a JTAG or Trace operation.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: March 1, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Patent number: 11255908
    Abstract: The present disclosure describes novel methods and apparatuses for directly accessing JTAG Tap domains that exist in a scan path of many serially connected JTAG Tap domains. Direct scan access to a selected Tap domain by a JTAG controller is achieved using auxiliary digital or analog terminals associated with the Tap domain and connected to the JTAG controller. During direct scan access, the auxiliary digital or analog terminals serve as serial data input and serial data output paths between the selected Tap domain and the JTAG controller.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: February 22, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Publication number: 20220043058
    Abstract: The disclosure describes a novel method and apparatus for making device TAPs addressable to allow device TAPs to be accessed in a parallel arrangement without the need for having a unique TMS signal for each device TAP in the arrangement. According to the disclosure, device TAPs are addressed by inputting an address on the TDI input of devices on the falling edge of TCK. An address circuit within the device is associated with the device's TAP and responds to the address input to either enable or disable access of the device's TAP.
    Type: Application
    Filed: October 22, 2021
    Publication date: February 10, 2022
    Inventor: Lee D. Whetsel
  • Patent number: 11243253
    Abstract: Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: February 8, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Patent number: 11237206
    Abstract: An integrated circuit die includes a substrate of semiconductor material having a top surface, a bottom surface, and an opening through the substrate between the top surface and the bottom surface. A through silicon via (TSV) has a conductive body in the opening, has a top contact point coupled to the body at the top surface, and has a bottom contact point coupled to the body at the bottom surface. A scan cell has a serial input, a serial output, control inputs, a voltage reference input, a response input coupled to one of the contact points, and a stimulus output coupled to the other one of the contact points.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: February 1, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Patent number: 11231461
    Abstract: This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: January 25, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Patent number: 11231463
    Abstract: The disclosure describes novel methods and apparatuses for accessing test compression architectures (TCA) in a device using either a parallel or serial access technique. The serial access technique may be controlled by a device tester or by a JTAG controller. Further the disclosure provides an approach to access the TCA of a device when the device exists in a daisy-chain arrangement with other devices, such as in a customer's system. Additional embodiments are also provided and described in the disclosure.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: January 25, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Lee D. Whetsel
  • Publication number: 20220018900
    Abstract: The disclosure describes a novel method and apparatus for improving interposers that connected stacked die assemblies to system substrates. The improvement includes the addition of IEEE 1149.1 circuitry within interposers to allow simplifying interconnect testing of digital and analog signal connections between the interposer and system substrate it is attached too. The improvement also includes the additional 1149.1 controlled circuitry that allows real time monitoring of voltage supply and ground buses in the interposer. The improvement also includes the additional of 1149.1 controlled circuitry that allows real time monitoring of functional digital and analog input and output signals in the interposer. The improvement also provides the ability to selectively serially link the 1149.1 circuitry in the interposer with 1149.1 circuitry in the die of the stack.
    Type: Application
    Filed: October 1, 2021
    Publication date: January 20, 2022
    Inventor: Lee D. Whetsel
  • Publication number: 20210405113
    Abstract: Testing of integrated circuits is achieved by a test architecture utilizing a scan frame input shift register, a scan frame output shift register, a test controller, and a test interface comprising a scan input, a scan clock, a test enable, and a scan output. Scan frames input to the scan frame input shift register contain a test stimulus data section and a test command section. Scan frames output from the scan frame output shift register contain a test response data section and, optionally, a section for outputting other data. The command section of the input scan frame controls the test architecture to execute a desired test operation.
    Type: Application
    Filed: September 9, 2021
    Publication date: December 30, 2021
    Inventor: Lee D. Whetsel
  • Publication number: 20210396807
    Abstract: The disclosure describes a novel method and apparatus for providing a shadow access port within a device. The shadow access port is accessed to perform operations in the device by reusing the TDI, TMS, TCK and TDO signals that are used to operate a test access port within the device. The presence and operation of the shadow access port is transparent to the presence and operation of the test access port. According to the disclosure, the shadow access port operates on the falling edge of the TCK signal while the test access port conventionally operates on the rising edge of the TCK signal.
    Type: Application
    Filed: August 31, 2021
    Publication date: December 23, 2021
    Inventor: Lee D. Whetsel