Patents by Inventor Lee-Der Chen

Lee-Der Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device components and methods
    Patent number: 9875964
    Abstract: Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: January 23, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Bi-Ling Lin, Jian-Hong Lin, Ming-Hong Hsieh, Lee-Der Chen, Jiaw-Ren Shih, Chwei-Ching Chiu
  • Semiconductor Device Components and Methods
    Publication number: 20140145194
    Abstract: Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end.
    Type: Application
    Filed: January 28, 2014
    Publication date: May 29, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Bi-Ling Lin, Jian-Hong Lin, Ming-Hong Hsieh, Lee-Der Chen, Jiaw-Ren Shih, Chwei-Ching Chiu
  • Semiconductor device components and methods
    Patent number: 8648592
    Abstract: Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: February 11, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Bi-Ling Lin, Jian-Hong Lin, Ming-Hong Hsieh, Lee-Der Chen, Jiaw-Ren Shih, Chwei-Ching Chiu
  • Semiconductor Device Components and Methods
    Publication number: 20130063175
    Abstract: Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end.
    Type: Application
    Filed: September 13, 2011
    Publication date: March 14, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Bi-Ling Lin, Jian-Hong Lin, Ming-Hong Hsieh, Lee-Der Chen, Jiaw-Ren Shih, Chwei-Ching Chiu