Abstract: A miniature vacuum chamber that is capable of testing individual dice prior to packaging is described. The upper portion of the chamber consists of a housing having testing probes and a vacuum inlet disposed therein. The lower portion of the chamber consists of a chuck that holds a wafer and a lower vacuum chamber. The lower portion is indexed to place a dice in contact with the probes. The upper and lower portions then form a seal and a vacuum is drawn in the area defined by the upper and lower chambers. The dice is then tested; the area pressurized; and the chuck indexed to test the next dice.

Abstract: The present invention consists of a miniature vacuum chamber that is capable of testing individual dice prior to packaging. The upper portion of the chamber consists of a housing having testing probes and a vacuum inlet disposed therein. The lower portion of the chamber consists of a chuck that holds a wafer and a lower vacuum chamber. The lower portion is indexed to place a dice in contact with the probes. The upper and lower portions then form a seal and a vacuum is drawn in the area defined by the upper and lower chambers. The dice is then tested; the area pressurized; and the chuck indexed to test the next dice.

Abstract: A method of testing the diaphragm portion of the die before the pressure sensor is assembled is disclosed. A mechanical pressure is exerted upon the diaphragm equivalent to any desired atmospheric pressure. The electrical output of the die is then measured to determine if it is within an acceptable range. If the electrical output is not within the acceptable range the resistors of the die can be trimmed at that time, prior to assembly.

Abstract: Laser marking of metal surfaces, particularly semiconductor device packages, is accomplished by depositing an electroless nickel layer on the surface, converting the nickel surface to a form in which it is highly absorptive of radiant energy and exposing the converted nickel surface to laser energy through a mask. The resulting mark is highly resistant to abrasion and corrosion. In addition, the method is highly suitable for use with automated laser marking equipment. Furthermore, it appears that the presence of the converted electroless nickel surface in the region of welds increases the hermeticity of the welds. This is particularly useful in packages of the TO-3 type and similar types.

Abstract: A resilient contact assembly for contacting a semiconductor device comprises a center segment and first and second side segments. The center segment has an open-ended pocket in the end thereof for receiving, positioning and supporting the semiconductor device. The ends of the side segment are bent out of the plane of the center segment and first and second contact arms extend therefrom towards said pocket to contact the semiconductor device.

Abstract: Laser marking of metal surfaces, particularly semiconductor device packages, is accomplished by depositing an electroless nickel layer on the surface, converting the nickel surface to a form in which it is highly absorptive of radiant energy and exposing the converted nickel surface to laser energy through a mask. The resulting mark is highly resistant to abrasion and corrosion. In addition, the method is highly suitable for use with automated laser marking equipment. Furthermore, it appears that the presence of the converted electroless nickel surface in the region of welds increases the hermeticity of the welds. This is particularly useful in packages of the TO-3 type and similar types.