Patents by Inventor Lee Goodrich
Lee Goodrich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9981824Abstract: A strap storage container has a strap storage rack and a crank mechanism for coiling the straps. The crank mechanism passes through the storage container and has a handle on a first end and strap receiving aperture (e.g., a slot) on a second end. The strap storage rack is removably insertable within the strap storage container.Type: GrantFiled: August 5, 2016Date of Patent: May 29, 2018Inventor: Lee Goodrich
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Publication number: 20170036885Abstract: A strap storage container has a strap storage rack and a crank mechanism for coiling the straps. The crank mechanism passes through the storage container and has a handle on a first end and strap receiving aperture (e.g., a slot) on a second end. The strap storage rack is removably insertable within the strap storage container.Type: ApplicationFiled: August 5, 2016Publication date: February 9, 2017Inventor: Lee Goodrich
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Patent number: 8087216Abstract: RFID tags pre-installed on bale wrap segments provide location information for a specific area of the bale wrap. RFID tag readers located on the cotton harvester provide signals for use by the module wrapping apparatus for initiating a cutting or separating operation, once a module has been wrapped, and for warning an operator of a situation where the wrapping function has not proceeded in an orderly fashion after a signal for starting the wrapping function has been received. A wrapped module carries the pre-installed RFID tags which are readable by RFID readers carried by module handlers in the field and/or at the gin input which identify the modules and establish a position to which the module may be automatically oriented so that an ideal module wrap cutting location is easily calculated. The RFID tag reading taken in the field or at the gin thus senses the number on the tag as well as the location of the tag, and the module identification is input to an electronic database.Type: GrantFiled: February 25, 2010Date of Patent: January 3, 2012Assignee: Deere & CompanyInventors: James Thomas Noonan, Donald Lee Goodrich, Jesse Dru Haecker, Jerry Bob Hall, Mark Alan Cracraft, Earl Franklin Canfield
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Patent number: 7868428Abstract: A PIN diode comprising an N-type substrate comprising a cathode of the PIN diode and having an intrinsic layer disposed upon the N-type substrate and having a top surface a P-type material disposed upon the top surface of the intrinsic layer comprising an anode of the PIN diode and a N-type material disposed over the sidewall of the cathode and over the sidewall and a portion of the top surface of the intrinsic material that is not occupied by the anode, wherein a horizontal gap is defined between the anode and the cathode through the intrinsic material, the gap being variable in width and/or the horizontal gap is less than the thickness of the intrinsic layer.Type: GrantFiled: March 14, 2008Date of Patent: January 11, 2011Assignee: M/A-COM Technology Solutions Holdings, Inc.Inventors: Joel Lee Goodrich, James Joseph Brogle
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Publication number: 20100186606Abstract: RFID tags pre-installed on bale wrap segments provide location information for a specific area of the bale wrap. RFID tag readers located on the cotton harvester provide signals for use by the module wrapping apparatus for initiating a cutting or separating operation, once a module has been wrapped, and for warning an operator of a situation where the wrapping function has not proceeded in an orderly fashion after a signal for starting the wrapping function has been received. A wrapped module carries the pre-installed RFID tags which are readable by RFID readers carried by module handlers in the field and/or at the gin input which identify the modules and establish a position to which the module may be automatically oriented so that an ideal module wrap cutting location is easily calculated. The RFID tag reading taken in the field or at the gin thus senses the number on the tag as well as the location of the tag, and the module identification is input to an electronic database.Type: ApplicationFiled: February 25, 2010Publication date: July 29, 2010Inventors: James Thomas Noonan, Donald Lee Goodrich, Jesse Dru Haecker, Jerry Bob Hall, Mark Alan Cracraft, Earl Franklin Canfield
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Patent number: 7694491Abstract: RFID tags pre-installed on bale wrap segments provide location information for a specific area of the bale wrap. RFID tag readers located on the cotton harvester provide signals for use by the module wrapping apparatus for initiating a cutting or separating operation, once a module has been wrapped, and for warning an operator of a situation where the wrapping function has not proceeded in an orderly fashion after a signal for starting the wrapping function has been received. A wrapped module carries the pre-installed RFID tags which are readable by RFID readers carried by module handlers in the field and/or at the gin input which identify the modules and establish a position to which the module may be automatically oriented so that an ideal module wrap cutting location is easily calculated. The RFID tag reading taken in the field or at the gin thus senses the number on the tag as well as the location of the tag, and the module identification is input to an electronic database.Type: GrantFiled: October 30, 2007Date of Patent: April 13, 2010Assignee: Deere & CompanyInventors: James Thomas Noonan, Donald Lee Goodrich, Jesse Dru Haecker, Jerry Bob Hall, Mark Alan Cracraft, Earl Franklin Canfield
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Publication number: 20090243088Abstract: A method of fabricating a plurality of layers of metal on a substrate depositing a first layer of metal on the substrate; depositing a first layer of planarization material over the substrate and first layer of metal to a depth above the top of the first layer of metal; polishing the first layer of planarization material down to at least the top of the first layer of metal; and depositing a second layer of metal on the first layer of metal and the first layer of planarization material.Type: ApplicationFiled: March 28, 2008Publication date: October 1, 2009Applicant: M/A-Com, Inc.Inventor: Joel Lee Goodrich
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Publication number: 20090242923Abstract: The invention is a hermetically sealed semiconductor die package wherein a surface of the die can be positioned very close to the hermetic package and a method of fabricating such a package. The invention is particularly suited to hermetically sealed circuit components, such as dies with a light emitting surface or light receiving surface for which it would be desirable to place the light emitting or light receiving surface as close as possible to a transparent window in the package so as to maximize the amount of light that can be transmitted out of the package.Type: ApplicationFiled: March 28, 2008Publication date: October 1, 2009Applicant: M/A-Com, Inc.Inventor: Joel Lee Goodrich
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Patent number: 7591628Abstract: A grapple device is provided for handling cylindrical cotton modules each having its circumference wrapped with a length of plastic sheet wrapping material. The grapple is equipped with a RFID reader for determining the location of a loose inner tail section of the wrapping material to which is attached an RFID tag assembly. The grapple device is also equipped with powered rollers which can be driven so as to cause the cotton module to be rotated about its axis so as to position the loose tail section of the wrapping material at an upper location of the module so as to permit a bottom surface location of the module to be slit by operation of a cutting device so as to release the cotton from the wrapper when the cotton module is positioned over a conveyor floor of a cotton gin. The powered rollers are then driven to aid in the removal and collection of the of the wrapping material from the module. In one embodiment, a separate set of powered rollers are provided for removing the wrapping material.Type: GrantFiled: October 30, 2007Date of Patent: September 22, 2009Assignee: Deere & CompanyInventors: James Thomas Noonan, Timothy Arthur Deutsch, Jerry Bob Hall, Donald Lee Goodrich
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Publication number: 20090230516Abstract: A PIN diode comprising an N-type substrate comprising a cathode of the PIN diode and having an intrinsic layer disposed upon the N-type substrate and having a top surface a P-type material disposed upon the top surface of the intrinsic layer comprising an anode of the PIN diode and a N-type material disposed over the sidewall of the cathode and over the sidewall and a portion of the top surface of the intrinsic material that is not occupied by the anode, wherein a horizontal gap is defined between the anode and the cathode through the intrinsic material, the gap being variable in width and/or the horizontal gap is less than the thickness of the intrinsic layer.Type: ApplicationFiled: March 14, 2008Publication date: September 17, 2009Applicant: M/A-Com, Inc.Inventors: Joel Lee Goodrich, James Joseph Brogle
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Publication number: 20090107348Abstract: A grapple device is provided for handling cylindrical cotton modules each having its circumference wrapped with a length of plastic sheet wrapping material. The grapple is equipped with a RFID reader for determining the location of a loose inner tail section of the wrapping material to which is attached an RFID tag assembly. The grapple device is also equipped with powered rollers which can be driven so as to cause the cotton module to be rotated about its axis so as to position the loose tail section of the wrapping material at an upper location of the module so as to permit a bottom surface location of the module to be slit by operation of a cutting device so as to release the cotton from the wrapper when the cotton module is positioned over a conveyor floor of a cotton gin. The powered rollers are then driven to aid in the removal and collection of the of the wrapping material from the module. In one embodiment, a separate set of powered rollers are provided for removing the wrapping material.Type: ApplicationFiled: October 30, 2007Publication date: April 30, 2009Inventors: James Thomas Noonan, Timothy Arthur Deutsch, Jerry Bob Hall, Donald Lee Goodrich
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Publication number: 20090107349Abstract: RFID tags pre-installed on bale wrap segments provide location information for a specific area of the bale wrap. RFID tag readers located on the cotton harvester provide signals for use by the module wrapping apparatus for initiating a cutting or separating operation, once a module has been wrapped, and for warning an operator of a situation where the wrapping function has not proceeded in an orderly fashion after a signal for starting the wrapping function has been received. A wrapped module carries the pre-installed RFID tags which are readable by RFID readers carried by module handlers in the field and/or at the gin input which identify the modules and establish a position to which the module may be automatically oriented so that an ideal module wrap cutting location is easily calculated. The RFID tag reading taken in the field or at the gin thus senses the number on the tag as well as the location of the tag, and the module identification is input to an electronic database.Type: ApplicationFiled: October 30, 2007Publication date: April 30, 2009Inventors: James Thomas Noonan, Donald Lee Goodrich, Jesse Dru Haecker, Jerry Bob Hall, Mark Alan Cracraft, Earl Franklin Canfield
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Patent number: 7402842Abstract: A light emitting diode package and method of manufacturing the light emitting diode package are provided. The light emitting diode package includes a sub-mount portion and a frame portion extending from the sub-mount portion. The frame portion has angled walls and is configured to receive a light emitting diode therein.Type: GrantFiled: August 9, 2004Date of Patent: July 22, 2008Assignee: M/A-COM, Inc.Inventor: Joel Lee Goodrich
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Patent number: 7026223Abstract: An electric component package having a base and a lid, the base and lid defining a hermetically sealed cavity therebetween for accommodating an electric component. The base includes at least one conductive via extending therethrough, allowing control and/or input/output (I/O) ports associated with the electric component to be coupled to the conducive vias to pass signals between the sealed cavity and the exterior of the package without passing through the junction between the base and lid. The electric component package can be produced at the wafer level using conventional silicon wafer integrated circuit manufacturing machinery prior to separating the wafer into a plurality of devices.Type: GrantFiled: March 28, 2002Date of Patent: April 11, 2006Assignee: M/A-Com, IncInventors: Joel Lee Goodrich, Timothy Edward Boles
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Publication number: 20060027826Abstract: A light emitting diode package and method of manufacturing the light emitting diode package are provided. The light emitting diode package includes a sub-mount portion and a frame portion extending from the sub-mount portion. The frame portion has angled walls and is configured to receive a light emitting diode therein.Type: ApplicationFiled: August 9, 2004Publication date: February 9, 2006Inventor: Joel Lee Goodrich
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Publication number: 20030183920Abstract: An electric component package having a base and a lid, the base and lid defining a hermetically sealed cavity therebetween for accommodating an electric component. The base includes at least one conductive via extending therethrough, allowing control and/or input/output (I/O) ports associated with the electric component to be coupled to the conducive vias to pass signals between the sealed cavity and the exterior of the package without passing through the junction between the base and lid. The electric component package can be produced at the wafer level using conventional silicon wafer integrated circuit manufacturing machinery prior to separating the wafer into a plurality of devices.Type: ApplicationFiled: March 28, 2002Publication date: October 2, 2003Inventors: Joel Lee Goodrich, Timothy Edward Boles
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Publication number: 20030085416Abstract: A Microwave/Millimeter-wave Monolithic Integrated Circuit (MMIC) device including PIN diode and Schottky diode circuits that provides improved performance with a reduced cost of manufacture. The planar, glass-passivated, MMIC device is fabricated in silicon technology and includes mesa isolation between the PIN diode and the Schottky diode. The PIN and Schottky diodes include respective anode regions having different thicknesses and resistivity for implementing the PIN and Schottky diode functions. Further, the Schottky anode region is formed relatively late in a process for fabricating the Si MMIC device to allow the Schottky anode region to be formed in approximately the same plane as the PIN anode region and to allow precise control of the relative thicknesses of the PIN and Schottky anode regions.Type: ApplicationFiled: November 8, 2001Publication date: May 8, 2003Applicant: TYCO ELECTRONICS CORPORATIONInventors: James Joseph Brogle, Daniel Gustavo Curcio, Joel Lee Goodrich
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Patent number: 6559024Abstract: A method of fabricating a hyperabrupt junction varactor diode structure comprises the steps of forming a non-uniformly doped n-type, hyperabrupt cathode region in a layer of semiconductor material and depositing, by ultra high vacuum chemical vapor deposition (UHVCVD), a p-type anode region onto a surface of the hyperabrupt cathode region. The deposition process is performed at relatively low temperature (i.e., below 600° C.). The anode region and the hyperabrupt cathode are joined at a junction between them such that an impurity concentration level of the hyperabrupt region increases in a direction toward the junction. During the forming step, n-type impurity ions are implanted at an implantation energy level substantially less than 300 keV, preferably between from about 10 to about 70 keV, with the implanted ions being thermally activated at a relatively low temperature (between from about 700 to about 800° C.).Type: GrantFiled: March 29, 2000Date of Patent: May 6, 2003Assignee: Tyco Electronics CorporationInventors: Timothy Edward Boles, Joel Lee Goodrich, Thomas Robert Lally, James Garfield Loring, Jr.
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Patent number: 6150197Abstract: A process for fabricating heterolithic microwave integrated circuits. According to one exemplary embodiment, a glass substrate is fused to a silicon wafer, and the silicon wafer is etched to effect silicon pedestals. A glass layer is fused onto and about the silicon mesas and effectively polished to expose the tops of the silicon mesas. The backside glass layer is then polished to render a final thickness of the dielectric layer between the top surface and ground plane. In another exemplary embodiment, a layer of silicon may be selectively etched to form mesas that function as either pedestals or vias. A layer of glass may be fused to the silicon prior to etching. A layer of glass is fused to the silicon substrate and pedestals and planarized through standard polishing techniques. The wafer may be "flipped over" and polished in order to remove a substantial portion of the silicon or glass, depending on which is used. Thereafter, the integrated circuit is fabricated through standard techniques.Type: GrantFiled: April 25, 1997Date of Patent: November 21, 2000Assignee: The Whitaker Corp.Inventors: Timothy Edward Boles, Joel Lee Goodrich
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Patent number: 6114716Abstract: Silicon conductive vias and pedestals are disclosed for use in microwave integrated circuits. The pedestals are isolated from a ground plane on the bottom surface by glass, while the vias are used to make electrical contact to ground. Electrical circuit elements in the top surface of the integrated circuit are selectively grounded or isolated by the choice of connection to a via or pedestal, respectively.Type: GrantFiled: April 25, 1997Date of Patent: September 5, 2000Assignee: The Whitaker CorporationInventors: Timothy Edward Boles, Joel Lee Goodrich