Patents by Inventor Lee Hang Meng@Eugene Lee

Lee Hang Meng@Eugene Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package
    Patent number: 9029990
    Abstract: An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: May 12, 2015
    Assignee: Texas Instruments Incorporated
    Inventors: Lee Hang Meng@Eugene Lee, Anis Fauzi Abdul Aziz, Yien Sien Khoo