Abstract: A semiconductor package is provided, including a laminate substrate with an aperture sized to receive a semiconductor die. Through-holes in the substrate are filled with a thermally conductive adhesive. A first heat spreader is attached to the by the adhesive, and a semiconductor die is positioned in the aperture with a back face in thermal contact with the heat spreader. Wire bonds couple the die to electrical traces on the substrate. A second heat spreader is attached by the adhesive to the substrate over the die, directly opposite the first heat spreader. A portion of the second heat spreader is encapsulated in molding compound. Openings in the second heat spreader admits molding compound to fill the space around the die between the heat spreaders. Heat is transmitted from the die to the first spreader, and thence, via the through-holes and conductive paste, to the second heat spreader.

Abstract: A semiconductor package is provided, including a laminate substrate with an aperture sized to receive a semiconductor die. Through-holes in the substrate are filled with a thermally conductive adhesive. A first heat spreader is attached to the by the adhesive, and a semiconductor die is positioned in the aperture with a back face in thermal contact with the heat spreader. Wire bonds couple the die to electrical traces on the substrate. A second heat spreader is attached by the adhesive to the substrate over the die, directly opposite the first heat spreader. A portion of the second heat spreader is encapsulated in molding compound. Openings in the second heat spreader admits molding compound to fill the space around the die between the heat spreaders. Heat is transmitted from the die to the first spreader, and thence, via the through-holes and conductive paste, to the second heat spreader.

Abstract: The integrated circuit packaging techniques of the disclosed embodiments utilize a thermally conductive heat sink to partially enclose an integrated circuit. The heat sink is separated from the integrated circuit by a substrate that is conformally positioned into a recess in the heat sink, enabling the heat sink to transfer thermal energy from the integrated circuit.

Abstract: A carrier tape for electrical components is provided comprising a tape having a length and a plurality of cavities along the length of the tape. Each cavity comprises inner side walls and a bottom surface and is capable of containing an electrical component.