Patents by Inventor Lee J. Dae

Lee J. Dae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the preparation of the modified resin and epoxy resin composition containing the modified resin for use in semiconductor encapsulation
    Patent number: 5109067
    Abstract: A process for preparing a modified resin and an epoxy resin composition for use in semiconductor encapsulation which comprises providing a quantity of epoxy resins, synthetic rubber compounds, and hydroxy modified polysiloxanes, reacting the epoxy resins with the synthetic rubber compounds, and reacting the resultant product of the initial reaction with the hydroxy modified polysiloxanes, the epoxy resin composition comprising 0.1-10% by weight of the modified resin, epoxy resin, curing agent, catalyst, releasing agent, coupling agent, and fibers.
    Type: Grant
    Filed: August 14, 1989
    Date of Patent: April 28, 1992
    Assignee: Korea Chemical Co., Ltd.
    Inventors: Lee J. Dae, Yoo C. Joon, Kim B. Sung