Abstract: A method and apparatus for a multi-chip module that is testable and reconfigurable based on testing results is accomplished by a multi-chip module that includes a first circuit disposed on a first chip substrate, a second circuit disposed on second chip substrate, and an interconnecting substrate operably coupled to the first chip substrate and the second chip substrate. The interconnecting substrate connects the first circuit to the second circuit. The interconnecting substrate includes external connectors for accessing signals within the multi-chip module, which allow the multi-chip module to be fully tested. This testing may include isolating the first circuit and/or the second circuit by disabling other circuits in order to allow each of the circuits to be exercised without interference from other circuits. After testing the multi-chip module, configuration circuitry included on the multi-chip module may be used to reconfigure the multi-chip module based on results of the testing.

Abstract: A method and apparatus for extending an on-chip processing device's access to memory are accomplished by depositing a processing circuit, memory, and configuration circuitry on a die. When the memory has sufficient digital storage capabilities for the processing circuit, the configuration circuitry directly couples an address bus and data bus between the memory and the processing device. When the memory does not have sufficient digital storage capabilities for the processing circuit, the configuration circuitry reconfigures the memory. In additional, the configuration circuitry extends the address bus to an external memory and combines the internal data bus with an external data bus. Configured in this manner, the processing device can access both the on-chip memory and the external memory as a single addressable memory, thereby increasing the memory available to the processing circuit.

Abstract: A method and apparatus for reconfiguring an integrated circuit based on testing results is accomplished by an integrated circuit that includes a first circuit, a second circuit, and configuration circuitry deposited on a single die. After testing of the die, the configuration circuitry configures the integrated circuit based on the results of the testing. If both circuits passed the testing, the configuration circuitry couples, where appropriate, the first and second circuits together. If, however, the first circuit failed the testing and the second circuit passed the testing, the configuration circuitry configures the integrated circuit as if only the second circuit were present on the die. If, however, the second circuit failed the testing and the first circuit passed the testing, the configuration circuitry configures the integrated circuit as if only the first circuit were present on the die.